Development of single phase liquid cooling solution for 3-D silicon modules

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 4, 2011, Pages 536-544

  Tan, S P ^a   Toh, Kok Chuan ^a   Khan, N ^b   Pinjala, D ^b   Kripesh, V ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

3 D packaging; flow distribution; liquid cooling; microchannels; thermal

Indexed keywords

3D PACKAGING; ELECTRONIC PACKAGING; FLOW DISTRIBUTION; INTERCONNECT SCHEMES; LIQUID-COOLING; PRODUCT MINIATURIZATION; THERMAL; THROUGH SILICON VIAS;

COOLING; ELECTRONICS PACKAGING; HEAT RESISTANCE; INLET FLOW; LIQUIDS;

MICROCHANNELS;

EID: 83455243539     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2100710     Document Type: Article

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