High-power high-linearity flip-chip bonded modified uni-traveling carrier photodiode

Optics Express

Volumn 19, Issue 26, 2011, Pages

  Li, Zhi ^a   Fu, Yang ^a   Piels, Molly ^b   Pan, Huapu ^a   Beling, Andreas ^a   Bowers, John E ^b   Campbell, Joe C ^a  

^a University of Virginia   (United States)

^b University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; PHOTODIODES;

FLIP CHIP; HIGH-POWER; OUTPUT POWER; RESPONSIVITY; REVERSE BIAS; UNI-TRAVELING CARRIER PHOTODIODE; UNI-TRAVELING CARRIERS;

BANDWIDTH;

EID: 83455173609     PISSN: None     EISSN: 10944087     Source Type: Journal    
DOI: 10.1364/OE.19.00B385     Document Type: Article

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