-
1
-
-
0027844933
-
Solder Joint Attachment Reliability Evaluation and Failure Analysis of Thin Small Outline Packages (TSOPs) with Alloy 42 Leads
-
December
-
Noctor, D., Bader, F. E., Viera, A. P., Boysan, P., Golwalker S. and Foehringer, R., 'Solder Joint Attachment Reliability Evaluation and Failure Analysis of Thin Small Outline Packages (TSOPs) with Alloy 42 Leads', IEEE Transactions on CHMT, Vol. 16, No. 8, pp. 961-971, December (1993).
-
(1993)
IEEE Transactions on CHMT
, vol.16
, Issue.8
, pp. 961-971
-
-
Noctor, D.1
Bader, F.E.2
Viera, A.P.3
Boysan, P.4
Golwalker, S.5
Foehringer, R.6
-
2
-
-
0001784769
-
Reliability of Plastic Ball Grid Array Assemblies
-
Chapter 13, ed. by J. H. Lau, McGraw-Hill
-
Darveaux, R., Banerji, K., Mawer, A. and Dody, G., 'Reliability of Plastic Ball Grid Array Assemblies', Chapter 13, 'Ball Grid Array Technology', ed. by J. H. Lau, McGraw-Hill, pp. 379-442 (1995).
-
(1995)
Ball Grid Array Technology
, pp. 379-442
-
-
Darveaux, R.1
Banerji, K.2
Mawer, A.3
Dody, G.4
-
3
-
-
0029710626
-
TSOP Solder Joint Reliability
-
Orlando, FL, May
-
Mei, Z., 'TSOP Solder Joint Reliability', Proceedings 46th ECTC, Orlando, FL, pp. 1232-1238, May (1996).
-
(1996)
Proceedings 46th ECTC
, pp. 1232-1238
-
-
Mei, Z.1
-
4
-
-
4744358081
-
-
Circuit Assembly, June
-
Zarrow, P. and Kopp, D., 'Component Technology: Decisions and Issues', Circuit Assembly, pp. 24-25, June (1996).
-
(1996)
Component Technology: Decisions and Issues
, pp. 24-25
-
-
Zarrow, P.1
Kopp, D.2
-
5
-
-
0038494738
-
How to Use Finite Element Analysis to Predict Solder Joint Fatigue Life
-
Nashville, TN, June
-
Darveaux, R., 'How to Use Finite Element Analysis to Predict Solder Joint Fatigue Life', Proceedings VIII International Congress on Experimental Mechanics, Nashville, TN, pp. 41-42, June (1996).
-
(1996)
Proceedings VIII International Congress on Experimental Mechanics
, pp. 41-42
-
-
Darveaux, R.1
-
6
-
-
0029708667
-
Solder Reliability Solutions: From LCCCs to Area Array Assemblies
-
Clech, J.-P., 'Solder Reliability Solutions: from LCCCs to Area Array Assemblies', Proceedings Nepcon West, pp. 1665-1680 (1996).
-
(1996)
Proceedings Nepcon West
, pp. 1665-1680
-
-
Clech, J.-P.1
-
7
-
-
0027816677
-
A Comprehensive Surface Mount Reliability Model Covering Several Generations of Packaging and Assembly Technology
-
December
-
Clech, J.-P., Manock, J. C., Noctor, D. M., Bader, F. E. and Augis. J. A., 'A Comprehensive Surface Mount Reliability Model Covering Several Generations of Packaging and Assembly Technology', IEEE Transactions on CHMT, Vol. 16, No. 8, pp. 949-960, December (1993).
-
(1993)
IEEE Transactions on CHMT
, vol.16
, Issue.8
, pp. 949-960
-
-
Clech, J.-P.1
Manock, J.C.2
Noctor, D.M.3
Bader, F.E.4
Augis, J.A.5
-
9
-
-
0027961266
-
Surface Mount Failure Statistics and Failure Free Time
-
Washington, DC, May
-
Clech, J.-P. Noctor, D. M., Manock, J. C., Lynott,G. W. and Bader, F. E., 'Surface Mount Failure Statistics and Failure Free Time'. Proceedings 44th ECTC, Washington, DC, pp. 487-497, May (1994).
-
(1994)
Proceedings 44th ECTC
, pp. 487-497
-
-
Clech, J.-P.1
Noctor, D.M.2
Manock, J.C.3
Lynott, G.W.4
Bader, F.E.5
-
10
-
-
0037818461
-
Crack Initiation and Growth in Surface Mount Solder Joints
-
Dallas, TX, November
-
Darveaux, R., 'Crack Initiation and Growth in Surface Mount Solder Joints'. Proceedings ISHM Conference, Dallas, TX, pp. 86-97. November (1993).
-
(1993)
Proceedings ISHM Conference
, pp. 86-97
-
-
Darveaux, R.1
-
11
-
-
1542540570
-
Materials, Structures, and Mechanics of Solder Joints for Surface Mount Microelectronics Technology
-
Fellbach. Germany, February
-
Sherry, W.M. and Hall, P. M., 'Materials, Structures, and Mechanics of Solder Joints for Surface Mount Microelectronics Technology'. Proceedings Interconnection Technology in Electronics, Fellbach. Germany, pp. 47-61, February (1988).
-
(1988)
Proceedings Interconnection Technology in Electronics
, pp. 47-61
-
-
Sherry, W.M.1
Hall, P.M.2
-
12
-
-
0024684623
-
Surface Mount Attachment Reliability of Clipleaded Ceramic Chip Carriers on FR-4 Circuit Boards
-
June
-
Engelmaier, W., 'Surface Mount Attachment Reliability of Clipleaded Ceramic Chip Carriers on FR-4 Circuit Boards'. IEEE Transactions on CHMT. Vol. 12, No. 2, pp. 284-296, June (1989).
-
(1989)
IEEE Transactions on CHMT
, vol.12
, Issue.2
, pp. 284-296
-
-
Engelmaier, W.1
-
13
-
-
4744364136
-
SOT-23 Surface Mount Attachment Reliability Studies
-
Boston, MA. November
-
Hines, L, L., 'SOT-23 Surface Mount Attachment Reliability Studies'. Proceedings IEPS, Boston, MA. pp. 613-629, November (1987).
-
(1987)
Proceedings IEPS
, pp. 613-629
-
-
Hines, L.L.1
-
14
-
-
0028372114
-
Reliability, of a 0.4 mm Pitch, 256-pin Plastic Quad Flat Pack No-clean and Water-clean Solder Joints
-
February
-
Lau, J. H., Pao, Y. H., Larner, C., Govila, R., Twerefour, S., Gilbert, D., Erasmus, S. and Dolot, S., 'Reliability, of a 0.4 mm Pitch, 256-pin Plastic Quad Flat Pack No-clean and Water-clean Solder Joints'. Soldering & Surface Mount Technology, No. 16. pp. 42-50, February (1994).
-
(1994)
Soldering & Surface Mount Technology
, Issue.16
, pp. 42-50
-
-
Lau, J.H.1
Pao, Y.H.2
Larner, C.3
Govila, R.4
Twerefour, S.5
Gilbert, D.6
Erasmus, S.7
Dolot, S.8
-
15
-
-
0027697719
-
Solder Joint Reliability of a Thin Small Outline Package (TSOP)
-
Lau, J., Golwalker, S., Boysan, P., Surratt, R., Forhinger, R. and Erasmus, S., 'Solder Joint Reliability of a Thin Small Outline Package (TSOP)', Circuit World, Vol. 20, No. 1, pp. 12-19 (1993).
-
(1993)
Circuit World
, vol.20
, Issue.1
, pp. 12-19
-
-
Lau, J.1
Golwalker, S.2
Boysan, P.3
Surratt, R.4
Forhinger, R.5
Erasmus, S.6
-
16
-
-
0342891878
-
Creep and Stress Relaxation in Solder Joints
-
Chapter 10. ed. by J. H. Lau, Van Nostrand Reinhold
-
Hall, P. M., 'Creep and Stress Relaxation in Solder Joints', Chapter 10. 'Solder Joint Reliability: Theory and Application'. ed. by J. H. Lau, Van Nostrand Reinhold, pp. 306-332 (1991).
-
(1991)
Solder Joint Reliability: Theory and Application
, pp. 306-332
-
-
Hall, P.M.1
-
17
-
-
0346520177
-
Temperature Cycling. Structural Response and Attachment Reliability of Surface Mounted Leaded Packages
-
Dallas, TX, November
-
Clech, J.-P. and Augis, J. A., 'Temperature Cycling. Structural Response and Attachment Reliability of Surface Mounted Leaded Packages'. Proceedings IEPS. Dallas, TX, pp. 305-325. November (1988).
-
(1988)
Proceedings IEPS
, pp. 305-325
-
-
Clech, J.-P.1
Augis, J.A.2
-
18
-
-
4744346614
-
Comparative Compliance of Generic Lead Designs for Surface Mounted Components
-
Boston, MA, November
-
Kotlowitz, R. W., 'Comparative Compliance of Generic Lead Designs for Surface Mounted Components', Proceedings IEPS. Boston, MA, Vol. 2, pp. 965-984, November (1987).
-
(1987)
Proceedings IEPS
, vol.2
, pp. 965-984
-
-
Kotlowitz, R.W.1
-
19
-
-
0025544147
-
Compliance Metrics for Surface Mount Component Lead Design
-
Las Vegas, NV, May
-
Kotlowitz, R. W., 'Compliance Metrics for Surface Mount Component Lead Design'. Proceedings ECTC, Las Vegas, NV, pp. 1054-1063. May (1990).
-
(1990)
Proceedings ECTC
, pp. 1054-1063
-
-
Kotlowitz, R.W.1
-
20
-
-
0003309562
-
Integrated Matrix Creep: Application to Accelerated testing and Lifetime Prediction
-
Chapter 16, ed. by J. H. Lau, Van Nostrand Reinhold
-
Knecht, S. and Fox, L., 'Integrated Matrix Creep: Application to Accelerated testing and Lifetime Prediction'. Chapter 16, 'Solder Joint Reliability: Theory and Applications', ed. by J. H. Lau, Van Nostrand Reinhold, pp. 508-544 (1991).
-
(1991)
Solder Joint Reliability: Theory and Applications
, pp. 508-544
-
-
Knecht, S.1
Fox, L.2
-
21
-
-
0023606297
-
Fatigue of Solder Joints in Surface Mount Devices
-
ASTM STP 942
-
Shine, M. C. and Fox, L. R., 'Fatigue of Solder Joints in Surface Mount Devices'. Low Cycle Fatigue, ASTM STP 942, pp. 588-610. (1988).
-
(1988)
Low Cycle Fatigue
, pp. 588-610
-
-
Shine, M.C.1
Fox, L.R.2
-
22
-
-
0024070078
-
A Creep Rupture Model for Two-phase Eutectic Solders
-
September
-
Wong, B., Helling, D. E. and Clark, R. W., 'A Creep Rupture Model for Two-phase Eutectic Solders'. IEEE CHMTT Transactions. Vol. II. No. 3, pp. 284-290, September (1988).
-
(1988)
IEEE CHMTT Transactions
, vol.2
, Issue.3
, pp. 284-290
-
-
Wong, B.1
Helling, D.E.2
Clark, R.W.3
-
23
-
-
0022240957
-
The Effects of Service and Material Variables on the Fatigue Behaviour of Solder Joints during the Thermal Cycles
-
Stone, D., Hanula, S, and Li, C.-Y., 'The Effects of Service and Material Variables on the Fatigue Behaviour of Solder Joints during the Thermal Cycles'. Proceedings Electronic Components Conference. pp. 46-51 (1985).
-
(1985)
Proceedings Electronic Components Conference
, pp. 46-51
-
-
Stone, D.1
Hanula, S.2
Li, C.-Y.3
-
24
-
-
0026673748
-
Constitutive Relations for Tin-based Solder Joints
-
San Diego, CA. May
-
Darveaux, R. and Banerji, K., Constitutive Relations for Tin-based Solder Joints'. Proceedings 42nd ECTC. San Diego, CA. pp. 538-551, May (1992).
-
(1992)
Proceedings 42nd ECTC
, pp. 538-551
-
-
Darveaux, R.1
Banerji, K.2
-
25
-
-
0021651241
-
Forces, Moments, and Displacements during Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed boards
-
December
-
Hall, P. M., 'Forces, Moments, and Displacements during Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed boards', IEEE Transactions on CHMT, Vol. 7, No. 4, pp. 314-327, December (1984).
-
(1984)
IEEE Transactions on CHMT
, vol.7
, Issue.4
, pp. 314-327
-
-
Hall, P.M.1
-
26
-
-
0029322286
-
Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints
-
June
-
Jih, E. and Pao, Y.-H., 'Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints', Journal of Electronic Packaging, ASME Transactions, Vol. 117, No. 2, pp. 94-99, June (1995).
-
(1995)
Journal of Electronic Packaging, ASME Transactions
, vol.117
, Issue.2
, pp. 94-99
-
-
Jih, E.1
Pao, Y.-H.2
-
27
-
-
0025558097
-
Local CTE Mismatch in SM Leaded Packages: A Potential Reliability Concern
-
Las Vegas, Nevada, May
-
Clech, J.-P., Langerman, F. M. and Augis, J. A., 'Local CTE Mismatch in SM Leaded Packages: A Potential Reliability Concern', Proceedings 40th ECTC, Las Vegas, Nevada, pp. 368-376, May (1990).
-
(1990)
Proceedings 40th ECTC
, pp. 368-376
-
-
Clech, J.-P.1
Langerman, F.M.2
Augis, J.A.3
-
28
-
-
4744370474
-
Reliability Assessment of Solder Joints on LCCC Packages
-
ed. by K. Bonner and S. Cornford, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, October
-
Wen, L. C., Mon, G. R. and Ross, R. G. Jr., 'Reliability Assessment of Solder Joints on LCCC Packages', in 'Summary of the Phase 1 Round Robin Solder Joint Life Prediction Model Results', ed. by K. Bonner and S. Cornford, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, October (1994).
-
(1994)
Summary of the Phase 1 Round Robin Solder Joint Life Prediction Model Results
-
-
Wen, L.C.1
Mon, G.R.2
Ross Jr., R.G.3
-
29
-
-
0029324150
-
Comparison of LCC Solder Joint Life Predictions with Experimental Data
-
June
-
Wen, L. C. and Ross, R. G. Jr., 'Comparison of LCC Solder Joint Life Predictions with Experimental Data'. ASME Transactions. Journal of Electronic Packaging, Vol. 117, No. 2. pp. 109-115. June (1995).
-
(1995)
ASME Transactions. Journal of Electronic Packaging
, vol.117
, Issue.2
, pp. 109-115
-
-
Wen, L.C.1
Ross Jr., R.G.2
-
30
-
-
4744362322
-
-
JPL D-13412, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA. June
-
Wen, L. C., Mon, G. R. and Ross, R. G. Jr., 'Guidelines for Solder Joint Reliability Determination'. JPL D-13412, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA. June (1996).
-
(1996)
Guidelines for Solder Joint Reliability Determination
-
-
Wen, L.C.1
Mon, G.R.2
Ross Jr., R.G.3
-
31
-
-
4744340767
-
Accelerated Testing and Predictive Modeling of the Attachment Reliability of Alloy 42 and Copper Leaded TSOPs
-
Boston, MA, June
-
Noctor, D. and Clech, J.-P., 'Accelerated Testing and Predictive Modeling of the Attachment Reliability of Alloy 42 and Copper Leaded TSOPs'. Proceedings Nepcon East, Boston, MA, pp. 193-206, June (1993).
-
(1993)
Proceedings Nepcon East
, pp. 193-206
-
-
Noctor, D.1
Clech, J.-P.2
-
32
-
-
0000564167
-
Thermal and Power Cycling Limits of Plastic Ball Gnd Array (PBGA) Assemblies
-
San Jose. CA. August
-
Darveaux, R. and Mawer, A., 'Thermal and Power Cycling Limits of Plastic Ball Gnd Array (PBGA) Assemblies'. Proceedings Surface Mount International. San Jose. CA. pp. 315-326, August (1995).
-
(1995)
Proceedings Surface Mount International
, pp. 315-326
-
-
Darveaux, R.1
Mawer, A.2
-
33
-
-
0003726306
-
Designed Experiment to Determine Attachment Reliability Drivers for PBGA Packages
-
San Jose, CA, August
-
Ejim, T. I., Holliday, A., Bader, F. E. and Gahr, S., 'Designed Experiment to Determine Attachment Reliability Drivers for PBGA PackageS'. Proceedings Surface Mount International. San Jose, CA, pp. 385-392, August (1995).
-
(1995)
Proceedings Surface Mount International
, pp. 385-392
-
-
Ejim, T.I.1
Holliday, A.2
Bader, F.E.3
Gahr, S.4
-
35
-
-
4744348997
-
Moiré Analysis and Modelling of Area Array Assemlies
-
Nashville, TN, June
-
Ejim, T. I. and Clech, J.-P., 'Moiré Analysis and Modelling of Area Array Assemlies'. Proceedings VIII International Congress on Experimental and Applied Mechanics, Nashville, TN, pp. 53-54, June (1996).
-
(1996)
Proceedings VIII International Congress on Experimental and Applied Mechanics
, pp. 53-54
-
-
Ejim, T.I.1
Clech, J.-P.2
-
36
-
-
0038753286
-
Thermal Expansivity and Thermal Stress in Multilayered Structures
-
Chapter 2, ed. by J. H. Lau, Van Nostrand Reinhold, NY
-
Hall, P. M., 'Thermal Expansivity and Thermal Stress in Multilayered Structures'. Chapter 2, 'Thermal Stress and Strain in Microelectronics Packaging'.ed. by J. H. Lau, Van Nostrand Reinhold, NY. pp. 78-94 (1993).
-
(1993)
Thermal Stress and Strain in Microelectronics Packaging
, pp. 78-94
-
-
Hall, P.M.1
-
37
-
-
4744359863
-
Measurement of Thermomechanical Deformations of Plastic Ball Grid Array Assemblies using Moire Interferometry
-
Grand Rapids. MI. June
-
Ejim, T. I., Clech, J.-P., Dodderar, T. D., Guo, Y. and Han, B., 'Measurement of Thermomechanical Deformations of Plastic Ball Grid Array Assemblies using Moire Interferometry'. Proceedings 1995 SEM (Society for Experimental Mechanics) Conference and Exhibit. Grand Rapids. MI. pp 121-125, June (1995).
-
(1995)
Proceedings 1995 SEM (Society for Experimental Mechanics) Conference and Exhibit
, pp. 121-125
-
-
Ejim, T.I.1
Clech, J.-P.2
Dodderar, T.D.3
Guo, Y.4
Han, B.5
-
41
-
-
4744366945
-
Finite Element Analysis of a Compliant Chip Scale Ball Grid Array Package
-
February
-
Fjelstad, J. and Perry, M., 'Finite Element Analysis of a Compliant Chip Scale Ball Grid Array Package'. Proceedings CHIPCON. February (1996).
-
(1996)
Proceedings CHIPCON
-
-
Fjelstad, J.1
Perry, M.2
-
42
-
-
0039232886
-
Thermal Stress Failures in Microelectronic Components - Review and Extension
-
Chapter 5. ed. by A. Bar-Cohen and A. D. Kraus. Hemisphere Publishing Co.
-
Suhir, E., 'Thermal Stress Failures in Microelectronic Components - Review and Extension'. Vol. 1. Chapter 5. in 'Advances in Thermal Modeling of Electronic Components and Systems', ed. by A. Bar-Cohen and A. D. Kraus. Hemisphere Publishing Co., pp. 337-412 (1990).
-
(1990)
Advances in Thermal Modeling of Electronic Components and Systems
, vol.1
, pp. 337-412
-
-
Suhir, E.1
-
43
-
-
0029231813
-
Application of Interferometric Techiques to Verification of Numerical Models for Microelectronics Packaging Design
-
InterPack '95. Maui. Hawaii. ASME. March
-
Han, B., Guo, Y. and Lim, C. K., 'Application of Interferometric Techiques to Verification of Numerical Models for Microelectronics Packaging Design'. 'Advances in Electronic Packaging'. InterPack '95. Maui. Hawaii. ASME. EEP-Vol. 10-2. pp. 1187-1194. March (1995).
-
(1995)
Advances in Electronic Packaging
, vol.10 EEP
, Issue.2
, pp. 1187-1194
-
-
Han, B.1
Guo, Y.2
Lim, C.K.3
-
44
-
-
0001384680
-
Cumulative Fatigue Damage
-
September
-
Miner. M. A., 'Cumulative Fatigue Damage'. Journal of Applied Mechanics, pp. A-159-A-184, September (1945).
-
(1945)
Journal of Applied Mechanics
-
-
Miner, M.A.1
-
45
-
-
0029217431
-
Optimising the Reliability of Thin Small Outline Package (TSOP) Solder Joints
-
InterPack '95. Maui. Hawaii. ASME, March
-
Darveaux. R., 'Optimising the Reliability of Thin Small Outline Package (TSOP) Solder Joints'. 'Advances in Electronic Packaging'. InterPack '95. Maui. Hawaii. ASME, EEP. Vol. 10-2. pp. 675-682. March (1995).
-
(1995)
Advances in Electronic Packaging
, vol.10 EEP
, Issue.2
, pp. 675-682
-
-
Darveaux, R.1
|