Silicon-based micro pulsating heat pipe for cooling electronics

Advanced Materials Research

Volumn 403-408, Issue , 2012, Pages 4260-4265

  Qu, Jian ^a   Wu, Huiying ^b  

^a JIANGSU UNIVERSITY   (China)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Filing ratio; Microchannel; Pulsating heat pipe; Silicon wafer

Indexed keywords

CIRCULATION FLOW; COOLING APPLICATIONS; FILING RATIO; FILLING RATIO; FLUID MOVEMENT; HOT SPOT; HYDRAULIC DIAMETER; INTEGRAL PART; MAXIMUM TEMPERATURE; POWER INPUT; PULSATING HEAT PIPE; SILICON-BASED; TRAPEZOIDAL MICROCHANNELS; WAFER TEMPERATURE; WALL TEMPERATURES; WORKING FLUID;

CCD CAMERAS; COOLING SYSTEMS; EVAPORATORS; HEAT PIPES; MICROCHANNELS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

ELECTRONIC COOLING;

EID: 83255170457     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.403-408.4260     Document Type: Conference Paper

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