Thermofluid dynamic study of flat-plate closed-loop pulsating heat pipes

Microscale Thermophysical Engineering

Volumn 6, Issue 4, 2003, Pages 303-317

  Khandekar, S ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COOLING; ETHANOL; GLASS; MICROELECTRONICS; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SUBSTRATES; TEMPERATURE DISTRIBUTION; THERMODYNAMIC PROPERTIES; WATER;

GLASS TUBE; MICROELECTRONICS COOLING; PULSATING HEAT PIPE; THERMAL SPREADER;

HEAT PIPES;

EID: 0000887723     PISSN: 10893954     EISSN: 10893954     Source Type: Journal    
DOI: 10.1080/10893950290098340     Document Type: Article

References (5)

1. H. Akachi, F. Polasek, and P. Stulc, Pulsating Heat Pipes, Proc. 5th Int. Heat Pipe Symp., Melbourne, Australia, pp. 208-217, 1996.
2. H. Akachi and Y. Miyazaki, Stereo-Type Heat Lane Heat Sink, Proc. 10th Int. Heat Pipe Conf., Stuttgart, Germany, 1997.
3. S. Nishio, Attempts to Apply Micro Heat Transfer to Thermal Management, Proc. Int. Conf. on Heat Transfer and Transport Phenomena in Microscale, Banff, Canada, pp. 32-40, 2000.
4. C. Sarno, J. Dezord, G. Moulin, M. Zaghdoudi, M. Lallemand, V. Sartre, M. Groll, M. Schneider, H. Holzer, T. Schmitt, J. Rantala, T. Aapro, and R. Lehtinimi, Use of Metal Matrix Composite Material Heat Pipes for the Thermal Management of High Integrated Electronic Packages, Proc. 11th Int. Heat Pipe Conf, Tokyo, Japan, 1999.
5. V. P. Carey, Liquid-Vapor Phase Change Phenomena, pp. 76-83, Hemisphere Publishing Corporation, 1992.