Interconnect technologies using carbon nanotubes: Current status and future challenges

Proceedings of the International Spring Seminar on Electronics Technology

Volumn , Issue , 2011, Pages 1-5

  Bailey, C ^a   Lu, H ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

3D PACKAGING; CURRENT STATUS; FORM FACTORS; FUTURE CHALLENGES; INTERCONNECT TECHNOLOGY; INTERCONNECTION TECHNOLOGY; MINIATURISATION; MODELING TECHNOLOGY; THROUGH-SILICON-VIA;

APPROXIMATION THEORY; CARBON NANOTUBES;

TECHNOLOGY;

EID: 82955219746     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2011.6053539     Document Type: Conference Paper

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