Efficient target preparation by combining laser ablation and FIB milling in a single tool

IEEE - 2011 Semiconductor Conference Dresden: Technology, Design, Packaging, Simulation and Test, SCD 2011 - International Conference, Workshop and Table-Top Exhibition

Volumn , Issue , 2011, Pages

  Stegmann, H ^a   Domer H ^a   Cai, H ^a   Rosenkranz, R ^b   Zschech, E ^b  

^a CARL ZEISS SMT AG   (Germany)

^b FRAUNHOFER INSTITUTE FOR NON DESTRUCTIVE TESTING   (Germany)

Author keywords

3D integration; ablation; FIB; laser; target preparation

Indexed keywords

3-D INTEGRATION; BURIED TARGETS; FIB; FIB MILLING; FOCUSED ION BEAM MILLING; JOINING TECHNOLOGY; SAMPLE PREPARATION; TARGET PREPARATION;

ABLATION; CHIP SCALE PACKAGES; JOINING; LASER ABLATION; LASERS; MILLING (MACHINING); SEMICONDUCTOR LASERS; THREE DIMENSIONAL;

PULSED LASERS;

EID: 82155181778     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SCD.2011.6068741     Document Type: Conference Paper

References (3)

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2. S. Martens, W. Mack, F. Courtade, P. Perdu, J. Wilde, and F. Voelklein, "Laser-Based Target Preparation in 3D Integrated electronic Packages", ASME J. Electronic Packaging 131(3), 2009, 031006.
3. S. Martens, M. Fink, W. Mack, F. Voelklein, and J. Wilde, "Simulation- Based Analysis of the Heat-Affected Zone during Target Preparation by Pulsed-Laser Ablation through Stacked Silicon Dies in 3D integrated System-in-Packages", Proc. 11th Int. EuroSimE Conf., 2010, pp.1-9.