122 GHz antenna-integration in a plastic package based on a flip chip interconnect

2011 IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Integration Technologies, IMWS 2011

Volumn , Issue , 2011, Pages 37-40

  Beer, Stefan ^a   Zwick, Thomas ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

flip chip; integrated antenna; Millimeter waves; packaging

Indexed keywords

ANTENNA DESIGN; FLIP CHIP; FLIP CHIP TECHNOLOGIES; INTEGRATED ANTENNAS; MEASUREMENT RESULTS; OFF-CHIP; PLASTIC PACKAGES; QFN PACKAGE;

CHIP SCALE PACKAGES; INTEGRATION; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PACKAGING; TECHNOLOGY;

ANTENNAS;

EID: 82055193603     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMWS3.2011.6061881     Document Type: Conference Paper

References (8)

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