Integration of slot antenna in LTCC package for 60GHz radios

Electronics Letters

Volumn 44, Issue 5, 2008, Pages 330-331

  Zhang, Y P ^a   Sun, M ^a   Chua, K M ^b   Wai, L L ^b   Liu, D X ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CERAMIC PRODUCTS; ELECTRIC IMPEDANCE; LOW TEMPERATURE PROPERTIES;

60GHZ RADIOS; ESTIMATED EFFICIENCY; IMPEDANCE BANDWIDTH; LTCC PACKAGE;

SLOT ANTENNAS;

EID: 40149087890     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20083352     Document Type: Article

References (5)

1. Zhang, Y.P., Guo, L.H., and Sun, M.: ' On-chip antennas for 60-GHz radios in silicon technology ', IEEE Trans. Electron Devices, 2005, 52, (7), p. 1664-1668 10.1109/TED.2005.850628 0018-9383
2. Chan, K.T., Chin, A., Chen, Y.P., Lin, Y.D., Duh, T.S., and Lin, W.J.: ' Integrated antennas on Si, proton-implanted Si and Si-on-quartz ', IEDM Tech. Dig., January, 2001, p. 903-906
3. Kim, J.G., Lee, H.S., Lee, H., Yoon, J.B., and Hong, S.: ' 60-GHz CPW-fed post-supported patch antenna using micromachining technology ', IEEE Microw. Wireless Compon. Lett., 2005, 15, (10), p. 635-637 10.1109/LMWC.2005.856690
4. Pfeiffer, U.R., Grzyp, J., Liu, D.X., Gaucher, B., Beukema, T., Floyd, B.A., and Reynolds, S.K.: ' A chip-scale packaging technology for 60-GHz wireless chipsets ', IEEE Trans. Microw. Theory Tech., 2006, 54, (8), p. 3387-3397 10.1109/TMTT.2006.877832 0018-9480
5. Grzyp, J., Liu, D.X., and Gaucher, B.: ' Packaging effects of a broadband 60GHz cavity-backed folded dipole superstrate antenna ', IEEE AP-S Int. Symp. Dig., June, 2007, p. 4365-4368