Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

International Journal of Adhesion and Adhesives

Volumn 32, Issue 1, 2012, Pages 82-88

  Sadeghinia, M ^a   Jansen, K M B ^a   Ernst, L J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Cure hardening; Epoxy epoxides; Mechanical properties; Viscoelastisity

Indexed keywords

ADDITIONAL STRESS; CURE KINETICS; CURE SHRINKAGE; CURE/HARDENING; DEGREE OF CURE; DYNAMIC MECHANICAL ANALYZER; EPOXY MOLDING COMPOUNDS; EPOXY/EPOXIDES; HIGH PRESSURE; MECHANICAL LOADING; MOLDING COMPOUND; PRODUCT FAILURES; SEMI-CONDUCTOR; TEMPERATURE DEPENDENT; THERMO-MECHANICAL; THERMOMECHANICAL PROPERTIES; VISCOELASTIC PROPERTIES; VISCOELASTISITY;

CURING; DIFFERENTIAL SCANNING CALORIMETRY; MOLDING; SHEET MOLDING COMPOUNDS; STRESSES; THERMAL EXPANSION;

MECHANICAL PROPERTIES;

EID: 81955167361     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2011.10.007     Document Type: Article

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