Stress-free temperature in a mixed-adhesive joint

Journal of Adhesion Science and Technology

Volumn 20, Issue 15, 2006, Pages 1705-1726

  Da Silva, Lucas F M ^a   Adams, R D ^b  

^a UNIVERSITY OF PORTO   (Portugal)

^b UNIVERSITY OF BRISTOL   (United Kingdom)

Author keywords

Aluminium; Composites; Dynamic mechanical analysis; Epoxy; Finite element stress analysis; Glass transition temperature; Stress free temperature; Thermal analysis

Indexed keywords

ADHESIVES; ALUMINUM COMPOUNDS; DYNAMIC MECHANICAL ANALYSIS; EPOXY RESINS; FINITE ELEMENT METHOD; FUSELAGES; GLASS TRANSITION; STRESS ANALYSIS; SUPERSONIC AIRCRAFT; THERMOANALYSIS; ALUMINUM; COMPOSITE MATERIALS; TEMPERATURE;

FINITE ELEMENT STRESS ANALYSIS; STRESS-FREE TEMPERATURE; SUPERSONIC AIRCRAFT FUSELAGE;

ADHESIVE JOINTS;

ADHERENDS; BONDED JOINT; CURE TEMPERATURE; DYNAMIC MECHANICAL; EPOXY; FINITE ELEMENT STRESS ANALYSIS; HIGH-TEMPERATURE ADHESIVES; LOW-TEMPERATURE ADHESIVES; STRESS-FREE TEMPERATURE; TEMPERATURE RANGE; THERMAL EXPANSION PROPERTIES; THERMAL STRAIN;

EID: 33846217866     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856106779024436     Document Type: Article

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