Mode II interfacial toughening through discontinuous interleaves for damage suppression and control

Composites Part A: Applied Science and Manufacturing

Volumn 43, Issue 1, 2012, Pages 121-128

  Yasaee, M ^a   Bond, I P ^a   Trask, R S ^a   Greenhalgh, E S ^b  

^a UNIVERSITY OF BRISTOL   (United Kingdom)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

A. Crack arrest; B. Fracture toughness; C. Delamination; D. Fractography

Indexed keywords

ADHESIVE FILM; ARAMID FIBRE; CRACK ARREST; CRACK INTERACTION; CRACK PATHS; DAMAGE SUPPRESSION; E-GLASS; END-LOADED SPLIT; EXPERIMENTAL MODES; FIBRE REINFORCED; FIBRE-REINFORCED EPOXY; FRACTOGRAPHIC; LOW STRAIN RATES; MODE II; PARENT MATERIALS; THERMOPLASTIC FILMS;

CRACK PROPAGATION; ENERGY ABSORPTION; FIBER REINFORCED MATERIALS; FRACTOGRAPHY; FRACTURE TOUGHNESS; GLASS FIBERS; STRAIN RATE; THERMOSETS;

CRACKS;

EID: 81855218069     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2011.09.026     Document Type: Article

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