Leaching copper from shredded particles of waste printed circuit boards

Journal of Hazardous Materials

Volumn 187, Issue 1-3, 2011, Pages 393-400

  Yang, Haiyu ^a   Liu, Jingyang ^b   Yang, Jiakuan ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b CHINESE RESEARCH ACADEMY OF ENVIRONMENTAL SCIENCES   (China)

Author keywords

Leaching; Recovery of copper; Waste management; Waste PCBs

Indexed keywords

COPPER IONS; COPPER LEACHING; COPPER RECOVERY; CUPRIC IONS; HYDROGEN PEROXIDE ADDITIONS; LEACHING SOLUTION; OPTIMUM LEACHING CONDITIONS; ROOM TEMPERATURE; SOLID/LIQUID RATIOS; SULFURIC ACID SOLUTION; SYSTEM VARIABLES; WASTE PRINTED CIRCUIT BOARD;

COPPER; HYDROGEN; HYDROGEN PEROXIDE; LEACHING; METAL IONS; OXIDATION; PRINTED CIRCUIT MANUFACTURE; RECOVERY; SULFURIC ACID; WASTE DISPOSAL;

PRINTED CIRCUIT BOARDS;

COPPER; CUPRIC ION; HYDROGEN PEROXIDE; OXIDIZING AGENT; SULFURIC ACID;

CONCENTRATION (COMPOSITION); COPPER; HYDROGEN PEROXIDE; LEACHING; OXIDANT; RECYCLING; SULFURIC ACID; TEMPERATURE EFFECT; WASTE MANAGEMENT;

ARTICLE; CONCENTRATION (PARAMETERS); CRYSTAL STRUCTURE; ELECTRONICS; LEACHING; METAL RECOVERY; PARTICLE SIZE; PRINTED CIRCUIT BOARD; ROOM TEMPERATURE; SOLID WASTE MANAGEMENT; TEMPERATURE DEPENDENCE;

COPPER; ELECTRONICS; PARTICLE SIZE; POLYCHLORINATED BIPHENYLS; TEMPERATURE;

EID: 79951818790     PISSN: 03043894     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jhazmat.2011.01.051     Document Type: Article

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