A dislocation-based constitutive description for modeling the behavior of FCC metals within wide ranges of strain rate and temperature

Mechanics of Materials

Volumn 43, Issue 12, 2011, Pages 901-912

  Rodriguez Martinez J A ^a   Rodriguez Millan M ^a   Rusinek, A ^b   Arias, A ^a  

^a UNIVERSIDAD CARLOS III DE MADRID   (Spain)

^b UNIVERSITÉ DE LORRAINE   (France)

Author keywords

Constitutive model; OFHC copper; Strain rate; Thermal activation; Viscoplasticity

Indexed keywords

ANALYTICAL PREDICTIONS; APPLIED STRESS; DISLOCATION DYNAMICS; DISLOCATIONS DENSITIES; EFFECTIVE STRESS; EXPERIMENTAL DATA; FCC METALS; GOOD CORRELATIONS; HALL PETCH RELATIONSHIP; INTERNAL STATE VARIABLES; INTERNAL STRESS; MATERIAL DEFORMATION; MATERIAL PARAMETER; OFHC COPPER; STRUCTURAL EVOLUTION; THERMAL ACTIVATION; THERMAL ACTIVATION ANALYSIS; THERMALLY ACTIVATED; THERMO-VISCOPLASTIC;

ACTIVATION ANALYSIS; CONSTITUTIVE MODELS; COPPER; DEFORMATION; FORECASTING; MATHEMATICAL MODELS; PLASTIC FLOW; POLYCRYSTALS; VISCOPLASTICITY;

STRAIN RATE;

EID: 80155182025     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechmat.2011.09.008     Document Type: Article

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