Improved solid-state planar Ti/Pd/Ag/AgCl/KCl-gel microreference electrode by silicon cap sealing package

Journal of Micro/Nanolithography, MEMS, and MOEMS

Volumn 8, Issue 3, 2009, Pages

  Huang, I Yu ^a   Wang, Shih Han ^b   Chu, Chi Chih ^a   Chiu, Chien Tai ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b I SHOU UNIVERSITY   (Taiwan)

Author keywords

Chip level packaging; Drift and offset voltage; Impedance and phase shift; Reproducibility; Ti Pd Ag AgCl KCl gel micro reference electrode

Indexed keywords

CHIP SCALE PACKAGES; ELECTROCHEMICAL ELECTRODES; PHASE SHIFT; SEALING (CLOSING);

AG/AGCL; CELL POTENTIAL; CHIP-LEVEL; CHIP-LEVEL PACKAGING; DOUBLE-LAYER CAPACITANCE; DRIFT VOLTAGE; HIGH REPRODUCIBILITY; LOW IMPEDANCE; MICROREFERENCE ELECTRODES; OFFSET VOLTAGE; OPERATION FREQUENCY; PLANAR TECHNOLOGY; REFERENCE ELECTRODES; REPRODUCIBILITY; SENSING APPLICATIONS; ZERO OFFSETS;

GELS;

EID: 80055102849     PISSN: 19325150     EISSN: 19325134     Source Type: Journal    
DOI: 10.1117/1.3196547     Document Type: Article

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