Numerical Thermal Analysis of a Wireless Cortical Implant with Two-Body Packaging

BioNanoScience

Volumn 1, Issue 3, 2011, Pages 78-88

  Silay, Kanber Mithat ^a   Dehollain, Catherine ^a   Declercq, Michel ^a  

^a EPFL   (Switzerland)

Author keywords

Bio heat equation; Finite difference time domain (FDTD) method; Implant packaging; Numerical thermal analysis; Wireless cortical implant

Indexed keywords

BIO-HEAT EQUATIONS; FINITE DIFFERENCE TIME DOMAIN SIMULATIONS; FINITE-DIFFERENCE TIME-DOMAIN (FDTD) METHODS; HIGH RESOLUTION; SAFETY PRECAUTIONS; SILICON CHIP; TEMPERATURE ELEVATION;

FINITE DIFFERENCE TIME DOMAIN METHOD; HISTOLOGY; NUMERICAL ANALYSIS; NUMERICAL METHODS; PARTIAL DIFFERENTIAL EQUATIONS; THERMOANALYSIS; THREE DIMENSIONAL COMPUTER GRAPHICS; TISSUE;

CHIP SCALE PACKAGES;

EID: 80055031567     PISSN: 21911630     EISSN: 21911649     Source Type: Journal    
DOI: 10.1007/s12668-011-0009-2     Document Type: Article

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