Numerical analysis of temperature elevation in the head due to power dissipation in a cortical implant

Proceedings of the 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS'08 - "Personalized Healthcare through Technology"

Volumn , Issue , 2008, Pages 951-956

  Silay, Kanber Mithat ^a   Dehollain, Catherine ^a   Declercq, Michel ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

NUMERICAL ANALYSIS;

CHIP SIZES; HUMAN HEAD; TEMPERATURE ELEVATION; TEMPERATURE INCREASE; TISSUE TYPES; TOTAL POWER DISSIPATION;

ELECTRIC LOSSES;

ARTICLE; BIOLOGICAL MODEL; BODY TEMPERATURE; BRAIN; COMPUTER SIMULATION; ENERGY TRANSFER; HEAD; HEAT; HUMAN; PHYSIOLOGY; PROSTHESES AND ORTHOSES;

BODY TEMPERATURE; BRAIN; COMPUTER SIMULATION; ENERGY TRANSFER; HEAD; HOT TEMPERATURE; HUMANS; MODELS, BIOLOGICAL; PROSTHESES AND IMPLANTS;

EID: 61849159715     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iembs.2008.4649312     Document Type: Conference Paper

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