Selective seeding of copper films on polyimide-patterned silicon substrate, using ion implantation

Sensors and Actuators, A: Physical

Volumn 52, Issue 1-3, 1996, Pages 126-131

  Bhansali, Shekhar ^a   Sood, Dinesh K ^a  

^a RMIT UNIVERSITY   (Australia)

Author keywords

Electroless Cu plating; Implantation; Polyimide; Silicon

Indexed keywords

SELECTIVE SEEDING; THRESHOLD IMPLANTATION DOSE;

COPPER; ELECTROLESS PLATING; ION IMPLANTATION; OPTICAL MICROSCOPY; POLYIMIDES; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SUBSTRATES;

METALLIC FILMS;

EID: 0030102269     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-4247(96)80137-3     Document Type: Article

References (6)

1. M.G. Allen, Polyimide based processes for fabrication of thick electroplated microstructures, Tech, Digest, 7th Int. Conf. Solid-State Sensors and Actuators (Transducers '93), Yokohama, Japan, 2-5 June, 1993, pp. 60-65.
2. S. Bhansali, D.K. Sood, R.B. Zmood, Selective electroless copper plating on silicon seeded by copper ion implantation, Thin Solid Films, 253 (1994) 391-394.
3. S. Bhansali and D.K. Sood, A novel technique for fabrication of metallic structures on polyimide by selective copper plating using ion implantation, Thin Solid Films, in press.
4. M.H. Kiang, J. Tao, W. Namgoong, C. Hu, M. Lieberman, N.W. Cheung, H.K. Kang and S.S. Wong, Planarized copper interconnects by selective electroless plating, Mater. Res. Soc. Symp. Proc., 265 (1992) 187-197.
5. S. Nakahara, C.Y. Mak and Y. Okinika, Effect of type of substrates on ductility and microstructure of electroless deposits, J.Electrochem. Soc., 140 (1993) 533-538.
6. R. Jagannathan and M. Krishnan, Electroless plating at a low pH level, IBM J. Res. Develop., 37 (1993) 117-123.