Electrospray deposition of thin copper-indium-diselenide films

International Journal of Materials Research

Volumn 102, Issue 10, 2011, Pages 1252-1260

  Choi, Kyung Hyun ^a   Muhammad, Nauman Malik ^a   Dang, Hyun Woo ^a   Lee, Ayoung ^b   Hwang, Jin Soo ^c   Nam, Jong Won ^c   Ryu, Beyoung Hwan ^c  

^a Jeju National University   (South Korea)

^b Seoul National University   (South Korea)

^c Korea Research Institute of Chemical Technology   (South Korea)

Author keywords

Copper indium diselenide; Electrospray deposition; Photovoltaics; Thin films

Indexed keywords

COPPER INDIUM DISELENIDE; COST EFFICIENCY; DEPOSITED LAYER; ELECTROSPRAY DEPOSITION; ELECTROSPRAYS; MANUFACTURING PROCESS; PHOTOVOLTAICS; ROLL-TO-ROLL FABRICATION; SCANNING ELECTRON MICROSCOPE; SINGLE-STEP; SINTERING TEMPERATURES; THICK LAYERS; VOLTAGE REQUIREMENT;

COPPER; INDIUM; MANUFACTURE; PHOTOELECTRON SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SELENIUM COMPOUNDS; SINTERING; THIN FILM DEVICES; THIN FILMS; VAPOR DEPOSITION; X RAY PHOTOELECTRON SPECTROSCOPY;

DEPOSITION;

EID: 80054928650     PISSN: 18625282     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.110581     Document Type: Article

References (34)

1. D.B. Mitzi: Solution Processing of Inorganic Materials, A. John Wiley & Sons, Inc., New Jersey (2009). DOI:10.1504/IJMMP.2009.032787
2. J. Kois, M. Ganchev, M. Kaelin, S. Bereznev, E. Tzvetkova, O. Volobujeva, N. Stratieva, A.N. Tiwari: Thin Solid Films 516 (2008) 5948. DOI:10.1016/j.tsf.2007.10.080 (Pubitemid 351763761)
3. R. Wieting, R. Gay, H. Nguyen, J. Palm, C. Rischmiller, A. Seapan, D. Tarrant, D. Willett: Proceedings of the 31st IEEE Photovoltaics Specialists Conference, USA (2005) 177.
4. R. Hollars, R. Dorn, P.D. Paulson, J. Titus, R. Zubeck: Proceedings of the Materials Research Society Symposium, U.S.A. (2005) F14.34.1.
5. C. Sene, M.E. Calixto, K.D. Dobson, R.W. Birkmire: Thin Solid Films 516 (2008) 2188. DOI:10.1016/j.tsf.2007.07.142 (Pubitemid 351174202)
6. V.K. Kapur, A. Bansal, P. Le, O.I. Asensio: Thin Solid Films 431 (2003) 53. DOI:10.1016/S0040-6090(03)00253-0
7. C. Eberspacher, K.L. Pauls, J.P. Serra: Proceedings of Materials Research Society Symposium, U.S.A. (2003) B8.27.1.
8. J.F. Mahoney, J. Perel: IEEE Industrial Applications Society Conference (1981) 1142.
9. T.M. Pang, P.D. Prewett, L. Gowland: Thin Solid Films 88 (1982) 219. DOI:10.1016/0040-6090(82)90050-5 (Pubitemid 12572290)
10. J.C. Almekinders, C. Jones: J. Aerosol Sci. 30 (1999) 969. DOI:10.1016/S0021-8502(98)00755-1 (Pubitemid 29281204)
11. J.D. Regele, M.J. Papac, M.J.A. Rickard, D.D. Rankin: J. Aerosol Sci. 33 (11) (2002) 1471. DOI:10.1016/S0021-8502(02)00093-9 (Pubitemid 35300477)
12. B. Su, K.L. Choy: Thin Solid Films 359 (2000) 160. DOI:10.1016/S0040- 6090(99)00733-6 (Pubitemid 30530946)
13. A. Jaworek, W. Balachandran, M. Lackowski, J. Kulon, A. Krupa: J. Electrostatics 64(3 -4) (2006) 194. DOI:10.1016/j.elstat.2005.05.006 (Pubitemid 43137212)
14. M. Sato: IEEE Trans. Ind. App. 27 (1991) 316. DOI:10.1109/28.73619
15. B. Su, K.L. Choy: J. Mater. Sci. Lett. 19 (2000) 1859. DOI:10.1023/A:1006723229844
16. R. Chandrasekhar, K.L. Choy: J. Crystal Growth 231 (2001) 215. DOI:10.1016/S0022-0248(01)01477-4 (Pubitemid 32698454)
17. M. Kaelin, H. Zogg, A.N. Tiwari, O. Wilhelm, S.E. Pratsinis, T. Meyer, A. Meyer: J. Thin Solid Films 457 (2004) 391. DOI:10.1016/S0040-6090(03)01033-2
18. C.H. Chen, J. Schoonman: J. Ind. Eng. Chem. 10 (2004) 1114.
19. S. Yoon, T. Yoon, K.-S. Lee, S. Yoon, J.M. Ha, S. Choe: Sol. Energ. Mat. Sol. C. 93 (2009) 783. DOI:10.1016/j.solmat.2008.09.061
20. A.M. Ganan-Calvo, J. Davila, A. Barrero: J. Aerosol Sci. 28 (1997) 249. DOI:10.1016/S0021-8502(96)00433-8 (Pubitemid 27036008)
21. A. Jaworek, A. Krupa: J. Aerosol Sci. 30 (1999) 873. DOI:10.1016/S0021- 8502(98)00787-3 (Pubitemid 29281198)
22. A. Jaworek: J. Mater. Sci. 42 (2007) 266. DOI:10.1007/s10853-006-0842-9 (Pubitemid 46154465)
23. S.R. Samarasinghe, I. Pastoriza-Santos, M.J. Edirisinghe, L.M. Liz-Marzan: Appl. Phys. A 91 (2008) 141. DOI:10.1007/s00339-007-4387-9
24. D.K. Dwivedi, Dayashankar, M. Dubey: J. Ovonic Res. 6 (2010) 57.
25. K.H. Choi, A. Rahman, J.B. Ko, A. Rehmani, Y.H. Doh: Int. J. Adv. Manuf. Technol. 48 (2010) 165 DOI:10.1007/s00170-009-2255-9
26. R.P.A. Hartman: PhD thesis, Technische Universiteit Delft, The Netherlands. (1992).
27. B.M. Basol, V.K. Kapur, C.R. Leidholm, A. Halani, K. Gledhill: Sol. Energ. Mat. Sol. C 43 (1996) 93. DOI:10.1016/0927-0248(95)00171-9 (Pubitemid 126392906)
28. N. Ishikawa, K. Tsujimura: The Japan Society of Mechanical Engineers 64 (1998).
29. J.N. Chung, T.R. Troutt: J. Fluid Mech. 186 (1988) 199. DOI:10.1017/S0022112088000102
30. N.M. Muhammad, K.Y. Kim, C.H. Huang, S. Kim: J. Ind. Eng. Chem. 16(1) (2010) 106. DOI:10.1016/j.jiec.2010.01.010
31. Y. Tatemoto, R. Ishikawa, M. Takaeuchi, T. Takeshita, K. Noda, T. Okazaki: Chem. Eng. Technol. 30 (2007) 1274. DOI:10.1002/ceat.200700060 (Pubitemid 47455499)
32. H. Oh, K. Kim, S. Kim: J. Aerosol Sci. 39 (2008) 801. DOI:10.1016/j.jaerosci.2008.05.003
33. G.M.H. Meesters, P.H.W. Vercoulen, J.C.M. Marijnissen, B. Scarlett: J. Aerosol Sci. 23 (1992) 37. DOI:10.1016/0021-8502(92)90316-N
34. J.B. Fenn, J. Rosell, C.K. Meng: J. Am. Soc. Mass Spectrom. 8 (1997) 1147. DOI:10.1016/S1044-0305(97)00161-X (Pubitemid 27451100)