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Volumn 457, Issue 2, 2004, Pages 391-396

Electrosprayed and selenized Cu/In metal particle films

Author keywords

Copper indium selenide; Electrospray; Nanoparticles; Selenization

Indexed keywords

ADHESION; ANNEALING; COPPER METALLOGRAPHY; ELECTRIC FIELDS; ETHANOL; INDIUM METALLOGRAPHY; NANOSTRUCTURED MATERIALS; OPTOELECTRONIC DEVICES; POLYCRYSTALLINE MATERIALS; PYROLYSIS; SELENIUM; THERMAL EFFECTS; THIN FILMS; X RAY DIFFRACTION;

EID: 2342570947     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)01033-2     Document Type: Article
Times cited : (37)

References (18)
  • 15
    • 0037997768 scopus 로고
    • Joint Committee on Powder Diffraction Standards, ASTM, Philadelphia, PA, Card 40-1487
    • Powder Diffraction File, Joint Committee on Powder Diffraction Standards, ASTM, Philadelphia, PA, 1967, Card 40-1487.
    • (1967) Powder Diffraction File
  • 16
    • 0037997768 scopus 로고
    • Joint Committee on Powder Diffraction Standards, ASTM, Philadelphia, PA, Card 6-416
    • Powder Diffraction File, Joint Committee on Powder Diffraction Standards, ASTM, Philadelphia, PA, 1967, Card 6-416.
    • (1967) Powder Diffraction File
  • 17
    • 0037997768 scopus 로고
    • Joint Committee on Powder Diffraction Standards, ASTM, Philadelphia, PA, Card 6-680
    • Powder Diffraction File, Joint Committee on Powder Diffraction Standards, ASTM, Philadelphia, PA, 1967, Card 6-680.
    • (1967) Powder Diffraction File


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.