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Volumn 1359, Issue , 2011, Pages 183-188

Fabrication of CMUT cells with gold center mass for higher output pressure

Author keywords

CMUT; Gold center mass; HIFU; Output pressure

Indexed keywords


EID: 80053622508     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.3607902     Document Type: Conference Paper
Times cited : (11)

References (7)
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    • Fluery, G.1
  • 2
    • 33845431955 scopus 로고    scopus 로고
    • Capacitive micromachined ultrasonic transducer arrays for integrated diagnostic/therapeutic catheters
    • S. H. Wong et al., "Capacitive Micromachined Ultrasonic Transducer arrays for Integrated Diagnostic/Therapeutic Catheters", American Institute of Physics, pp. 395-399, 2006.
    • (2006) American Institute of Physics , pp. 395-399
    • Wong, S.H.1
  • 3
    • 34548784329 scopus 로고    scopus 로고
    • Design of HIFU CMUT arrays for treatment of liver and renal cancer
    • S. H. Wong, et al., "Design of HIFU CMUT Arrays for Treatment of Liver and Renal Cancer", American Institute of Physics, pp. 54-60, 2007.
    • (2007) American Institute of Physics , pp. 54-60
    • Wong, S.H.1
  • 5
    • 60349121064 scopus 로고    scopus 로고
    • Capacitive micromachined ultrasonic transducers with piston-shaped membranes: Fabrication and experimental characterization
    • Y. Huang, et al., "Capacitive micromachined ultrasonic transducers with piston-shaped membranes: Fabrication and experimental characterization", Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on, vol. 56, no. 1, pp. 136-145, 2009.
    • (2009) Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on , vol.56 , Issue.1 , pp. 136-145
    • Huang, Y.1
  • 6
    • 0037387686 scopus 로고    scopus 로고
    • Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology
    • Y. Huang, et al., "Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology", Microelectromechanical Systems, vol. 12, no. 2, pp. 128- 137, 2003.
    • (2003) Microelectromechanical Systems , vol.12 , Issue.2 , pp. 128-137
    • Huang, Y.1
  • 7
    • 78649356172 scopus 로고    scopus 로고
    • Finite element analysis of fabrication related thermal effects in capacitive micromachined ultrasonic transducers
    • M. Kupnik, et al., "Finite element analysis of fabrication related thermal effects in capacitive micromachined ultrasonic transducers," in Proc. IEEE Ultrasonics Symposium, pp. 938-941, 2006.
    • (2006) Proc. IEEE Ultrasonics Symposium , pp. 938-941
    • Kupnik, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.