The role of pH and Cu(II) concentration in the electrodeposition of Cu(II) in NH4Cl solutions

Journal of Electroanalytical Chemistry

Volumn 401, Issue 1-2, 1996, Pages 171-182

  Nila, Carmen ^a   González, Ignacio ^a  

^a UNIVERSIDAD AUTÓNOMA METROPOLITANA   (Mexico)

Author keywords

Copper electrodeposition; Copper ammonia complexes; Copper chloride complexes; Nucleation

Indexed keywords

AMMONIA; AMMONIUM COMPOUNDS; CHLORINE; COPPER; COPPER PLATING; CURRENT VOLTAGE CHARACTERISTICS; CYCLIC VOLTAMMETRY; INTERFACES (MATERIALS); NUCLEATION; PH EFFECTS; REACTION KINETICS; REDOX REACTIONS;

AMMONIUM CHLORIDE; CHRONOAMPEROMETRY; TRIANGULAR POTENTIAL SCAN VOLTAMMETRY;

ELECTRODEPOSITION;

EID: 0029719828     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/0022-0728(95)04278-4     Document Type: Article

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