Electrochemical modeling and study of copper deposition from concentrated ammoniacal sulfate solutions

Hydrometallurgy

Volumn 99, Issue 1-2, 2009, Pages 58-66

  Giannopoulou, Ioanna ^a   Panias, Dimitrios ^a   Paspaliaris, Ioannis ^a  

^a NATIONAL TECHNICAL UNIVERSITY OF ATHENS   (Greece)

Author keywords

Copper ammine; Copper deposition; Electrochemistry; Potentiostatic reduction; Thermodynamic modeling

Indexed keywords

AMMINE COMPLEXES; AMMONIACAL SOLUTION; CATHODIC DEPOSITION; CATHODIC REACTIONS; CELL VOLTAGES; COPPER DEPOSITION; ELECTROCHEMICAL BEHAVIORS; ELECTROCHEMICAL EXPERIMENTS; ELECTROCHEMICAL MODELING; ELECTROLYTIC DEPOSITION; HIGH IONIC STRENGTH; INDUCTION PERIODS; METALLIC COPPER; OXIDATIVE CONDITIONS; POTENTIOSTATIC REDUCTION; REDOX CONDITION; REDOX POTENTIALS; REDOX SYSTEMS; SIGMOID CURVES; SULFATE SOLUTIONS; THERMO DYNAMIC ANALYSIS; THERMODYNAMIC MODELING; TWO-STEP MECHANISMS; TWO-STEP REDUCTION; TYPE CURVES;

CELL MEMBRANES; COPPER; COPPER METALLURGY; COPPER PLATING; DEPOSITION; ELECTRIC POTENTIAL; ELECTROCHEMISTRY; ELECTROLYTIC ANALYSIS; IONIC STRENGTH; REDOX REACTIONS; REDUCTION; THERMOANALYSIS; THERMODYNAMICS;

COPPER COMPOUNDS;

EID: 68949214967     PISSN: 0304386X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.hydromet.2009.06.009     Document Type: Article

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