Recent development in pixel level packaging for uncooled IRFPA

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7834, Issue , 2010, Pages

  Rabaud, W ^a   Dumont, G ^a   Baillin, X ^a   Carle, L ^a   Lagoutte, E ^a   Pellat, M ^a   Goudon, V ^a   Vialle, C ^a   Arnaud, A ^a  

^a CEA LETI   (France)

Author keywords

IRFPA; low cost; Micro bolometer; pixel level packaging; thin film getters

Indexed keywords

IRFPA; LOW COST; MICRO-BOLOMETER; PIXEL LEVEL PACKAGING; THIN FILM GETTERS;

BOLOMETERS; COST REDUCTION; GETTERS; INFRARED DETECTORS; INNOVATION; METALS; PIXELS; TECHNOLOGY; TEMPERATURE SENSORS; THIN FILMS; VACUUM;

PACKAGING;

EID: 79251622754     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.868462     Document Type: Conference Paper

References (2)

1. Dumont G. et al, "Innovative on-chip packaging applied to uncooled IRFPA", Infrared technology and Applications XXXIV, proc. of SPIE Vol. 6940, 69401Y (2008)
2. M. Vilain, "Procédés et dispositifs de fabrication de détecteurs de rayonnement", FR 2 822 541 French Patent, (2001).