Cure kinetics and conductivity of rigid rod epoxy with polyaniline as a curing agent

Polymer Composites

Volumn 30, Issue 10, 2009, Pages 1394-1400

  Fu, Tiezhu ^a   Liu, Jia ^a   Wang, Jing ^a   Na, Hui ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE ENERGY; COATS-REDFERN; CURE KINETICS; CURE REACTIONS; CURING AGENTS; CURING REACTIONS; DEGREE OF CONVERSION; ISO-CONVERSIONAL METHOD; RIGID RODS; TEMPERATURE RANGE; THERMAL STABILITY; WEIGHT CONTENT;

ACTIVATION ENERGY; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; MORPHOLOGY; POLYANILINE; REACTION KINETICS; RESINS; SCANNING ELECTRON MICROSCOPY; THERMOGRAVIMETRIC ANALYSIS;

CURING;

EID: 70349558420     PISSN: 02728397     EISSN: 15480569     Source Type: Journal    
DOI: 10.1002/pc.20703     Document Type: Article

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