Power circuit design for clean switching

2010 6th International Conference on Integrated Power Electronics Systems, CIPS 2010

Volumn , Issue , 2011, Pages

  Bayerer, Reinhold ^a   Domes, Daniel ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT DESIGNS; CURRENT-SHARING; DRIVE SIGNAL; IMPROVING POWER; INTEGRAL SOLUTIONS; LOW VOLTAGES; PARASITIC INDUCTANCES; POWER CIRCUIT; POWER CIRCUIT DESIGN; POWER MODULE; POWER SEMICONDUCTORS; SWITCHING CHARACTERISTICS;

DESIGN; OPTIMIZATION; POWER ELECTRONICS; SWITCHING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 79953740955     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Miller, Gerhard: New Semiconductor Technologies challenge Package and System Setups, CIPS, Nurnberg, 2010.
2. Stolze,T, et.al: Reliability of PressFIT connections, PCIM, Nurnberg, 2008.
3. Thoben, M. et.al: Utilizing press-fit for solderless assembly of pin grid connected power modules, PCIM, Nurnberg, 2007.
4. Stockmeier T, et.al: 1200 A, 3300 V IGBT Power Module exhibiting Very Low Internal Stray Inductance, PCIM, Hong Kong, 1997.
5. Bayerer, Reinhold: Modultechnik für hohe Frequenzen in der Leistungselektronik, VDEFachtagung - Bauelemente der Leistungselektronik und ihre Anwendungen, Bad Nauheim 1992.
6. Bayerer, Reinhold et.al: Advanced module construction for high speed high current IGBT modules, PCIM, Munich, 1990.