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Volumn 56, Issue 24, 2011, Pages 8776-8782
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Effect of copper pretreatment on the zincate process and subsequent electroplating of a protective copper/nickel deposit on the AZ91D magnesium alloy
a
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Author keywords
Adhesion strength; AZ91D Mg alloy; Corrosion protection; Cu pretreatment; Nickel electrodeposition
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Indexed keywords
ACTIVATION PROCESS;
AZ91D MAGNESIUM ALLOYS;
AZ91D MG ALLOY;
CROSS-SECTIONAL SCANNING ELECTRON MICROSCOPIES;
CU LAYERS;
HIGH DENSITY;
MG ALLOY;
NI COATING;
NICKEL ELECTRODEPOSITION;
NUCLEATION SEEDS;
PLATING PROCESS;
PRE-TREATMENT;
ZINCATE PROCESS;
ZN DEPOSITION;
ALLOYS;
BOND STRENGTH (MATERIALS);
CERIUM ALLOYS;
COPPER DEPOSITS;
CORROSION PROTECTION;
CORROSION RESISTANCE;
DEPOSITS;
DISSOLUTION;
ELECTROPLATING;
MAGNESIUM;
MAGNESIUM ALLOYS;
SCANNING ELECTRON MICROSCOPY;
ZINC;
ADHESION;
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EID: 80052794413
PISSN: 00134686
EISSN: None
Source Type: Journal
DOI: 10.1016/j.electacta.2011.07.086 Document Type: Article |
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Times cited : (45)
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References (22)
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