Influence of zincate pretreatment on adhesion strength of a copper electroplating layer on AZ91 D magnesium alloy

Surface and Coatings Technology

Volumn 205, Issue 8-9, 2011, Pages 3050-3057

  Tang, Jinwei ^a   Azumi, Kazuhisa ^a  

^a HOKKAIDO UNIVERSITY   (Japan)

Author keywords

Adhesion strength; AZ91 D Mg alloy; Copper electrodeposition; Zincate pretreatment

Indexed keywords

ADHESION STRENGTHS; ADHESION TEST; AZ91 D MG ALLOY; COPPER ELECTRODEPOSITION; COPPER ELECTROPLATING; CU LAYERS; CU SURFACES; INITIAL STAGES; MG ALLOY; MIXED LAYER; PHASE SURFACE; PLATING BATH; PLATING LAYER; PRE-TREATMENT; ULTRASONIC AGITATION;

ADHESION; ALLOYS; BOND STRENGTH (MATERIALS); COPPER; COPPER DEPOSITS; ELECTROPLATING; MAGNESIUM; MAGNESIUM ALLOYS; SCANNING ELECTRON MICROSCOPY; ZINC;

CERIUM ALLOYS;

EID: 78650210938     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.11.021     Document Type: Article

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