A pretreatment with galvanostatic etching for copper electrodeposition on pure magnesium and magnesium alloys in an alkaline copper-sulfate bath

Electrochimica Acta

Volumn 53, Issue 24, 2008, Pages 7235-7241

  Huang, C A ^a   Wang, T H ^a   Weirich, T ^b   Neubert, V ^c  

^a CHANG GUNG UNIVERSITY   (Taiwan)

^b RWTH AACHEN UNIVERSITY   (Germany)

^c Zentrum Funktionswerkstoffe gGmbH   (Germany)

Author keywords

Copper electrodeposition; Environmentally friendly process; Galvanostatic etching; Mg and Mg alloys; Protective coating

Indexed keywords

ALLOYS; CLADDING (COATING); COPPER; COPPER ALLOYS; COPPER DEPOSITS; DEPOSITS; ELECTROCHEMISTRY; ELECTRODEPOSITION; ELECTROPLATING; ETCHING; LIGHT METALS; MAGNESIUM; MAGNESIUM ALLOYS; METALLIC COMPOUNDS; METALLIZING; NICKEL; PLATING; PROTECTIVE COATINGS; REDUCTION; SULFATE MINERALS;

(1 1 0) SURFACE; (E ,3E) PROCESS; (O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER; COPPER ELECTRODEPOSITION; ELECTROPLATING BATHS; ELSEVIER (CO); ENVIRONMENTALLY-FRIENDLY; GALVANOSTATIC; MG ALLOYS; NI ELECTRODEPOSITION; PLATING BATHS; PRE TREATMENTS; PURE MAGNESIUM; STAGE III; SULFATE BATH;

MAGNESIUM PRINTING PLATES;

ALLOY; COATING; COPPER; ELECTROPLATING; ETCHING; MAGNESIUM; METALIZATION; PRINTING PLATES; PROTECTIVE COATINGS; SULFATES;

EID: 48149098618     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.04.074     Document Type: Article

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