Long-term corrosion of copper in a dilute anaerobic sulfide solution

Electrochimica Acta

Volumn 56, Issue 23, 2011, Pages 7854-7861

  Chen, J ^a   Qin, Z ^a   Shoesmith, D W ^a  

^a UNIVERSITY OF WESTERN ONTARIO   (Canada)

Author keywords

Copper; Corrosion; Diffusion; Electrochemical impedance spectroscopy; Sulfide

Indexed keywords

CORROSION FILM; CORROSION POTENTIALS; CU SURFACES; DEEP GEOLOGIC REPOSITORIES; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY MEASUREMENTS; ENERGY DISPERSIVE X RAY SPECTROSCOPY; EXPOSURE PERIOD; EXPOSURE-TIME; FILM STRUCTURE; FOCUSED ION BEAM MILLING; GROWTH PROCESS; IMMERSION TIME; LONG-TERM CORROSION; MECHANISM OF CORROSION; NACL SOLUTION; NON-UNIFORM THICKNESS; NUCLEAR FUEL WASTES; OXYGEN FREE COPPER; S-LAYERS; SULFIDE; SULFIDE FILMS;

ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; FILM GROWTH; HYDRAULIC STRUCTURES; RADIOACTIVE WASTE DISPOSAL; RADIOACTIVE WASTE ENCAPSULATION; SCANNING ELECTRON MICROSCOPY; SODIUM CHLORIDE; SOLUTIONS; X RAY SPECTROSCOPY;

COPPER;

EID: 80052734619     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2011.04.086     Document Type: Conference Paper

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