Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

Rare Metals

Volumn 30, Issue 4, 2011, Pages 408-413

  Chen, Chao ^a   Guo, Hong ^a   Chu, Ke ^a   Yin, Fazhang ^a   Zhang, Ximing ^a   Han, Yuanyuan ^a   Fan, Yeming ^a  

^a GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS   (China)

Author keywords

copper; diamonds; metallic matrix composites; pressure infiltration; size distribution; thermal conductivity

Indexed keywords

ANALYTICAL MODEL; BIMODAL DISTRIBUTION; BIMODAL PARTICLES; BIMODAL SIZE DISTRIBUTION; COARSE-TO-FINE; DIAMOND PARTICLES; LIQUID COPPER; PRESSURE INFILTRATION; THEORETICAL VALUES; VOLUME RATIO;

DIAMONDS; MATHEMATICAL MODELS; METALLIC MATRIX COMPOSITES; PARTICLE SIZE; PREFORMING; SEEPAGE; SIZE DISTRIBUTION; SOIL MECHANICS; SURFACE ROUGHNESS;

THERMAL CONDUCTIVITY;

EID: 80052654816     PISSN: 10010521     EISSN: 18677185     Source Type: Journal    
DOI: 10.1007/s12598-011-0405-3     Document Type: Article

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