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Volumn 19, Issue 9, 2011, Pages 972-979

Synthesis and properties of LED-packaging epoxy resin toughened by a novel polysiloxane from hydrolysis and condensation

(5) Ma, Songqi a,b Liu, Weiqu a Gao, Nan a,b Yan, Zhenlong a,b Zhao, Yuan a,b

a GUANGZHOU INSTITUTE OF CHEMISTRY (China)

b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES (China)

Author keywords

epoxy resin; LED packaging; morphology; polysiloxane; thermal; toughness

Indexed keywords

CURED EPOXY RESINS; DEGREE OF BRANCHING; EPOXIDE GROUPS; FLEXIBLE SEGMENTS; FRACTURE SURFACES; FTIR; HYDROLYSIS AND CONDENSATION; LED-PACKAGING; MODIFIED EPOXY; MOLAR RATIO; THERMAL; THERMAL AND MECHANICAL PROPERTIES; TOUGHENING AGENTS; TRIMETHOXYSILANE; UV-VIS SPECTROSCOPY;

CONDENSATION; CRACK TIPS; DIFFERENTIAL SCANNING CALORIMETRY; FILMS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; FRACTURE; FRACTURE TESTING; GEL PERMEATION CHROMATOGRAPHY; HYDROLYSIS; LIGHT EMITTING DIODES; MECHANICAL PROPERTIES; MORPHOLOGY; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; RESONANCE; SILICA; SILICON; SILICONES; SIZE EXCLUSION CHROMATOGRAPHY; SYNTHETIC RESINS; TENSILE STRENGTH; TENSILE TESTING; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS; ULTRAVIOLET SPECTROSCOPY;

EPOXY RESINS;

EID: 80052646881 PISSN: 15985032 EISSN: 20927673 Source Type: Journal
DOI: 10.1007/s13233-011-0911-z Document Type: Article

Times cited : (24)

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