Polydimethylsiloxane containing isocyanate group-modified epoxy resin: curing, characterization, and properties

Journal of Applied Polymer Science

Volumn 73, Issue 13, 1999, Pages 2739-2747

  Shih, Wen Chang ^a   Ma, Chen Chi M ^a   Yang, Jen Chang ^b   Chen, Hung De ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MODIFICATION; CURING; ELASTIC MODULI; EPOXY RESINS; GLASS TRANSITION; REACTION KINETICS; STRESSES; SYNTHESIS (CHEMICAL); TEMPERATURE; THERMAL EXPANSION;

FLEXIBILITY; FLEXURAL MODULUS; ISOCYANATE; METHYL DIANILINE; POLYDIMETHYLSILOXANE;

SILICONES;

EID: 0033345040     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19990923)73:13<2739::AID-APP22>3.0.CO;2-F     Document Type: Article

References (13)

1. Broutman, L J.; McGarry, F. H. J Appl Polym Sci 1965, 9, 609.
2. Shih, W. C.; Ma, C. C. M. J Appl Polym Sci 1998, 69, 51.
3. Bucknall, C. O.; Partridge, I. K. Polymer 1983, 24, 639.
4. Bucknall, C. B.; Gilbert, A. H. Polymer 1989, 30, 213.
5. Hedrick, J. C.; McGrath, J. E. Polym Bull 1985, 13, 201.
6. Iijima, T.; Tochimoto, T.; Tomoi, M. J Appl Polym Sci 1991, 43, 1685.
7. Wang, H. H.; Chen, J. C. J Appl Polym Sci 1995, 57, 671.
8. Carfagna, C.; Nicolais, L.; Amendola, E.; Filippov, A. G. J Appl Polym Sci 1992, 44, 1465.
9. Patel, R. D. Br. Polym J 1989, 19, 37.
10. Kissinger, H. E. Anal Chem 1957, 29, 1702.
11. Pusatcioglu, S. Y.; Fricke, A. L.; Hassler, J. C. J Appl Polym Sci 1979, 24, 937.
12. Lem, K-W.; Han, C. D. Polym Eng Sci 1984, 24, 175.
13. Yorkgitis, E. M.; Eiss, N. S., Jr.; Tran, C.; Wilkes, G. L.; McGrath, J. E. Epoxy Resins and Composites, I; Springer Verlag: Berlin, 1985.