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Volumn , Issue , 2009, Pages 2818-2822

Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA GAINS; CMOS POWER AMPLIFIERS; DIFFERENTIAL DESIGNS; FLIP CHIP; FLIP CHIP TECHNOLOGIES; GHZ FREQUENCIES; HIGH EFFICIENCY; LOW LOSS; MECHANICAL RIGIDITY; RADIATION PATTERNS;

EID: 70349868468     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (9)

References (12)
  • 3
    • 70349855298 scopus 로고    scopus 로고
    • RO4000 Series high frequency circuit materials, Rogers Corporation, Chandler, USA.
    • RO4000 Series high frequency circuit materials, Rogers Corporation, Chandler, USA.
  • 4
  • 5
    • 0037718458 scopus 로고    scopus 로고
    • Microwave characterization of a microstrip line using a two-port ring resonator with an improved lumped-element model
    • May
    • J. R. Bray and L. Roy, "Microwave characterization of a microstrip line using a two-port ring resonator with an improved lumped-element model," IEEE Trans. Microwave Theory Tech., vol. 51, no. 5, pp. 1540-1547, May 2003.
    • (2003) IEEE Trans. Microwave Theory Tech , vol.51 , Issue.5 , pp. 1540-1547
    • Bray, J.R.1    Roy, L.2
  • 7
    • 70349853154 scopus 로고    scopus 로고
    • Sensitivity analysis and optimisation of electromagnetic structures
    • Ottawa, Canada, July
    • J. Akkermans and M. Herben, "Sensitivity analysis and optimisation of electromagnetic structures," in Int. Symp. Electromagnetic Theory (EMTS07), Ottawa, Canada, July 2007.
    • (2007) Int. Symp. Electromagnetic Theory (EMTS07)
    • Akkermans, J.1    Herben, M.2
  • 8
    • 0035521170 scopus 로고    scopus 로고
    • Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects
    • November
    • A. Sutono, N. Cafaro, J. Laskar, and M. Tentzeris, "Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects," IEEE Trans. Adv. Packag., vol. 24, no. 4, pp. 595-603, November 2001.
    • (2001) IEEE Trans. Adv. Packag , vol.24 , Issue.4 , pp. 595-603
    • Sutono, A.1    Cafaro, N.2    Laskar, J.3    Tentzeris, M.4
  • 9
    • 0034986867 scopus 로고    scopus 로고
    • Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz
    • May
    • A. Jentzsch and W. Heinrich, "Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz," IEEE Trans. Microwave Theory Tech., vol. 49, no. 5, pp. 871-878, May 2001.
    • (2001) IEEE Trans. Microwave Theory Tech , vol.49 , Issue.5 , pp. 871-878
    • Jentzsch, A.1    Heinrich, W.2
  • 11
    • 0036398189 scopus 로고    scopus 로고
    • J. Jordan, Gold stud bump in flip-chip applications, in Int. Electronics Manufacturing Technol. Sym.IEEE/SEMI International, 2002, pp. 110-114.
    • J. Jordan, "Gold stud bump in flip-chip applications," in Int. Electronics Manufacturing Technol. Sym.IEEE/SEMI International, 2002, pp. 110-114.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.