Low temperature Pyrex/silicon wafer bonding via a single intermediate parylene layer

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Volumn , Issue , 2011, Pages 366-369

  Ciftlik, A T ^a   Gijs, M A M ^a  

^a EPFL   (Switzerland)

Author keywords

3D integration; microfluidics; packaging; Parylene bonding

Indexed keywords

3-D INTEGRATION; ANODIC BONDING; BONDING INTERFACES; BONDING METHODS; BONDING STRENGTH; LOW TEMPERATURES; MICROFLUIDIC CHANNEL; MICROPATTERNED; PARYLENE BONDING; PARYLENE C; PARYLENES; PYREX WAFERS; SINGLE LAYER; WAFER BONDING TECHNIQUES;

ACTUATORS; MICROFLUIDICS; MICROSYSTEMS; SEMICONDUCTING SILICON COMPOUNDS; SILICON OXIDES; SILICON WAFERS; SOLID-STATE SENSORS;

WAFER BONDING;

EID: 80052114165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TRANSDUCERS.2011.5969475     Document Type: Conference Paper

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