Multilevel interconnect networks for the end of the roadmap: Conventional Cu/low-k and emerging carbon based interconnects

2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011

Volumn , Issue , 2011, Pages

  Ceyhan, Ahmet ^a   Naeemi, Azad ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON-BASED; FUTURE TECHNOLOGIES; GRAIN BOUNDARY SCATTERING; INTERCONNECT APPLICATIONS; INTERCONNECT NETWORKS; INTERCONNECT POWER; LINE EDGE ROUGHNESS; LOW-COST DESIGN; METAL LEVELS; MULTILEVEL INTERCONNECTION; POTENTIAL POWER; ROADMAP; SINGLE WALL NANOTUBES; SIZE EFFECTS; TECHNOLOGY NODES;

GRAIN BOUNDARIES; GRAPHENE; INTERCONNECTION NETWORKS; METALLIZING; NANOTUBES; ROUGHNESS MEASUREMENT; SINGLE-WALLED CARBON NANOTUBES (SWCN); TECHNOLOGY;

DESIGN;

EID: 80052073737     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2011.5940314     Document Type: Conference Paper

References (7)

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