Curing kinetics, thermomechanical and microwave behaviors of PANI-doped BSA/epoxy resin composites

Polymer Journal

Volumn 43, Issue 8, 2011, Pages 683-691

  Belaabed, Belkacem ^a   Lamouri, Saad ^a   Wojkiewicz, Jean Luc ^b,c  

^a ECOLE MILITAIRE POLYTECHNIQUE   (Algeria)

^b UNIV LILLE   (France)

^c ECOLE DES MINES DE DOUAI   (France)

Author keywords

conducting polymer composite; electromagnetic shielding effectiveness; epoxy resin; polyaniline; thermomechanical

Indexed keywords

CONDUCTING FILLERS; CONDUCTING POLYMER COMPOSITES; CURING KINETICS; CURING PARAMETERS; CURING PROCESS; CURING TEMPERATURE; DYNAMIC MECHANICAL THERMAL ANALYSIS; DYNAMIC MODES; ELECTROMAGNETIC BEHAVIOR; ELECTROMAGNETIC SHIELDING EFFECTIVENESS; LOADING LEVEL; MATRIX; MICROWAVE BANDS; MICROWAVE BEHAVIOR; RESIN COMPOSITES; STRUCTURE AND MORPHOLOGY; SULFONIC ACID; THERMO-MECHANICAL; VICKERS; VISCOELASTIC BEHAVIORS; WORK FOCUS;

BENZENE; COMPOSITE MATERIALS; CURING; DIELECTRIC PROPERTIES OF SOLIDS; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; ELECTRIC PROPERTIES; ELECTROMAGNETIC SHIELDING; ELECTROMAGNETISM; FILLERS; HEATING; INVESTMENTS; MAGNETIC SHIELDING; ORGANIC CONDUCTORS; POLYANILINE; POLYMER MATRIX COMPOSITES; SCANNING ELECTRON MICROSCOPY; SYNTHETIC RESINS; THERMOANALYSIS;

EPOXY RESINS;

EID: 80051517669     PISSN: 00323896     EISSN: 13490540     Source Type: Journal    
DOI: 10.1038/pj.2011.46     Document Type: Article

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