24-element antenna-in-package for stationary 60-GHz Communication scenarios

IEEE Antennas and Wireless Propagation Letters

Volumn 10, Issue , 2011, Pages 738-741

  Hong, Wonbin ^a   Goudelev, Alexander ^a   Baek, Kwang Hyun ^a   Arkhipenkov, Vladimir ^a   Lee, Juhyung ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Analog beamforming; antenna in package (AiP); low temperature co fired ceramics (LTCC); millimeter wave; Patch antenna

Indexed keywords

ANALOG BEAMFORMING; ANTENNA FEEDS; ANTENNA IN PACKAGES; BEAM-STEERING; BORESIGHT; CIRCULAR PATCH ANTENNA; DESIGN CONDITION; DESIGN PROCESS; EM SIMULATIONS; FLIP CHIP TECHNOLOGIES; H-PLANES; HIGH-RELIABILITY; INTEGRATED MULTILAYERS; LOW-TEMPERATURE CO-FIRED CERAMICS (LTCC); NEAR-FIELD MEASUREMENT; PATCH ANTENNA; PROTOTYPE FEATURES; SOLDER BUMP; SYSTEM LEVELS;

MICROSTRIP ANTENNAS; SOLDERING;

ANTENNA PHASED ARRAYS;

EID: 80051508064     PISSN: 15361225     EISSN: None     Source Type: Journal    
DOI: 10.1109/LAWP.2011.2162640     Document Type: Article

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