3D system-in-package integration of 60 GHz aperture-coupled micromachined microstrip antennas

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2010, Pages 1028-1031

  Brebels, Steven ^a,b   Mohammadpour Aghdam, Karim ^a,b   De Raedt, Walter ^a   Vandenbosch, Guy ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Active antennas; Antenna measurements; Millimeter wave antennas; Thin film circuit packaging

Indexed keywords

3D SYSTEMS; ACTIVE ANTENNAS; ACTIVE INTEGRATED ANTENNA; AIR CAVITY; ANTENNA MEASUREMENTS; APERTURE COUPLED; CAVITY RESONANCES; HIGH RESISTIVITY SILICON; MICROMACHINED; MILLIMETER-WAVE ANTENNAS; WIDEBAND ANTENNA;

MICROSTRIP ANTENNAS; MILLIMETER WAVES; THIN FILM CIRCUITS; THIN FILMS;

MILLIMETER WAVE DEVICES;

EID: 77957774200     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2010.5517387     Document Type: Conference Paper

References (6)

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