Thermal analysis of a phase change material based heat sink for cooling protruding electronic chips

Journal of Thermal Science

Volumn 18, Issue 3, 2009, Pages 268-275

  Faraji, Mustapha ^a   El Qarnia, Hamid ^a   Lakhal, El Khadir ^b  

^a CADI AYYAD UNIVERSITY   (Morocco)

^b FACULTÉ DES SCIENCES SEMLALIA   (Morocco)

Author keywords

Natural convection; Phase change material; Protruding electronic component

Indexed keywords

ELECTRONIC CHIPS; ELECTRONIC COMPONENT; HEAT SOURCES; LIQUID FRACTION; MAXIMUM TEMPERATURE; MELTING TEMPERATURES; N-EICOSANE; NUMERICAL INVESTIGATIONS; PLATE THICKNESS; PROTRUDING ELECTRONIC COMPONENT; RECTANGULAR ENCLOSURES; TEMPERATURE PROFILES; THERMAL ANALYSIS; THRESHOLD TEMPERATURES; VOLUMETRIC RATES; WORKING TIME;

BUOYANCY; MELTING POINT; NATURAL CONVECTION; PARAFFINS; THERMOANALYSIS;

PHASE CHANGE MATERIALS;

EID: 70349199756     PISSN: 10032169     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11630-009-0268-1     Document Type: Article

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