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Volumn 35, Issue 7, 2011, Pages 1274-1281

Application of nanofluids to a heat pipe liquid-block and the thermoelectric cooling of electronic equipment

Author keywords

Electronic cooling; Heat pipe liquid block; Heat transfer; Nanofluid; Thermoelectric

Indexed keywords

AIR COOLING SYSTEM; AIR-COOLED COOLING SYSTEMS; COMPUTING ABILITIES; COOLANT TEMPERATURE; COOLED SYSTEMS; COOLING TECHNIQUE; HEAT PUMPS; NANO-FLUID; NANOFLUIDS; THERMAL PERFORMANCE; THERMOELECTRIC; THERMOELECTRIC COOLING; VOLUME CONCENTRATION; WORKING FLUID;

EID: 79960995074     PISSN: 08941777     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.expthermflusci.2011.04.015     Document Type: Article
Times cited : (162)

References (22)
  • 1
    • 34247506730 scopus 로고    scopus 로고
    • Heat transfer of impinging jet array over concave-dimpled surface with applications to cooling of electronic chipsets
    • Chang S.W., Chiou S.F., Chang S.F. Heat transfer of impinging jet array over concave-dimpled surface with applications to cooling of electronic chipsets. Experimental Thermal and Fluid Science 2007, 31(7):625-640.
    • (2007) Experimental Thermal and Fluid Science , vol.31 , Issue.7 , pp. 625-640
    • Chang, S.W.1    Chiou, S.F.2    Chang, S.F.3
  • 2
    • 34447319643 scopus 로고    scopus 로고
    • Spray cooling heat transfer: the state of the art
    • Kim J. Spray cooling heat transfer: the state of the art. International Journal of Heat and Fluid Flow 2007, 28(4):753-767.
    • (2007) International Journal of Heat and Fluid Flow , vol.28 , Issue.4 , pp. 753-767
    • Kim, J.1
  • 3
    • 3142573268 scopus 로고    scopus 로고
    • Thermoelectric cooler application in electronic cooling
    • Chein R., Huang G. Thermoelectric cooler application in electronic cooling. Applied Thermal Engineering 2004, 24(14-15):2207-2217.
    • (2004) Applied Thermal Engineering , vol.24 , Issue.14-15 , pp. 2207-2217
    • Chein, R.1    Huang, G.2
  • 4
    • 67651166665 scopus 로고    scopus 로고
    • Design, manufacturing and testing of a portable vaccine carrier box employing thermoelectric module and heat pipe
    • Putra N. Design, manufacturing and testing of a portable vaccine carrier box employing thermoelectric module and heat pipe. Journal of Medical Engineering and Technology 2009, 33(3):232-237.
    • (2009) Journal of Medical Engineering and Technology , vol.33 , Issue.3 , pp. 232-237
    • Putra, N.1
  • 6
    • 59649125264 scopus 로고    scopus 로고
    • Liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU
    • Naphon P., Wiriyasart S. Liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU. International Communications in Heat and Mass Transfer 2009, 36(2):166-171.
    • (2009) International Communications in Heat and Mass Transfer , vol.36 , Issue.2 , pp. 166-171
    • Naphon, P.1    Wiriyasart, S.2
  • 7
    • 78049265325 scopus 로고    scopus 로고
    • The characterization of a cascade thermoelectric cooler in a cryosurgery device
    • Putra N., Ardiyansyah, Sukyono W., Johansen D., Iskandar F.N. The characterization of a cascade thermoelectric cooler in a cryosurgery device. Cryogenics 2010, 50(11-12):759-764.
    • (2010) Cryogenics , vol.50 , Issue.11-12 , pp. 759-764
    • Putra, N.1    Ardiyansyah Sukyono, W.2    Johansen, D.3    Iskandar, F.N.4
  • 8
    • 0029427666 scopus 로고
    • U.S. Choi, Enhancing thermal conductivity of fluids with nanoparticles, in: D.A. Siginer, H.P. Wang (Eds.), Developments and applications of non-Newtonian flows, FED/MD-vol. 66, ASME, New York
    • U.S. Choi, Enhancing thermal conductivity of fluids with nanoparticles, in: D.A. Siginer, H.P. Wang (Eds.), Developments and applications of non-Newtonian flows, FED-vol. 231/MD-vol. 66, ASME, New York, 1995, pp. 99-105.
    • (1995) , vol.231 , pp. 99-105
  • 9
    • 33846598376 scopus 로고    scopus 로고
    • Heat transfer enhancement using Al2 O3 -water nanofluid for an electronic liquid cooling system
    • Nguyen C.T., Roy G., Gauthier C., Galanis N. Heat transfer enhancement using Al2 O3 -water nanofluid for an electronic liquid cooling system. Applied Thermal Engineering 2007, 27(8-9):1501-1506.
    • (2007) Applied Thermal Engineering , vol.27 , Issue.8-9 , pp. 1501-1506
    • Nguyen, C.T.1    Roy, G.2    Gauthier, C.3    Galanis, N.4
  • 10
    • 33745233809 scopus 로고    scopus 로고
    • Cooling performance of a microchannel heat sink with nanofluids
    • Jang S.P., Choi S.U.S. Cooling performance of a microchannel heat sink with nanofluids. Applied Thermal Engineering 2006, 26(17-18):2457-2463.
    • (2006) Applied Thermal Engineering , vol.26 , Issue.17-18 , pp. 2457-2463
    • Jang, S.P.1    Choi, S.U.S.2
  • 14
    • 76749090944 scopus 로고    scopus 로고
    • Effect of nanofluids on the thermal performance of a flat micro heat pipe with a rectangular grooved wick
    • Do K.H., Jang S.P. Effect of nanofluids on the thermal performance of a flat micro heat pipe with a rectangular grooved wick. International Journal of Heat and Mass Transfer 2010, 53(9-10):2183-2192.
    • (2010) International Journal of Heat and Mass Transfer , vol.53 , Issue.9-10 , pp. 2183-2192
    • Do, K.H.1    Jang, S.P.2
  • 17
  • 18
  • 19
    • 72449182251 scopus 로고    scopus 로고
    • Thermal performance of an oscillating heat pipe with Al2O3-water nanofluids
    • Qu J., Wu H., Cheng P. Thermal performance of an oscillating heat pipe with Al2O3-water nanofluids. International Communications in Heat and Mass Transfer 2010, 37(2):111-115.
    • (2010) International Communications in Heat and Mass Transfer , vol.37 , Issue.2 , pp. 111-115
    • Qu, J.1    Wu, H.2    Cheng, P.3
  • 20
    • 1042269645 scopus 로고    scopus 로고
    • Effect of structural character of gold nanoparticles in nanofluid on heat pipe thermal performance
    • Tsai C.Y., Chien H.T., Ding P.P., Chan B., Luh T.Y., Chen P.H. Effect of structural character of gold nanoparticles in nanofluid on heat pipe thermal performance. Materials Letters 2004, 58(9):1461-1465.
    • (2004) Materials Letters , vol.58 , Issue.9 , pp. 1461-1465
    • Tsai, C.Y.1    Chien, H.T.2    Ding, P.P.3    Chan, B.4    Luh, T.Y.5    Chen, P.H.6
  • 21
    • 58549091075 scopus 로고    scopus 로고
    • Experimental investigation of nanofluids on sintered heat pipe thermal performance
    • Kang S.W., Wei W.C., Tsai S.H., Huang C.C. Experimental investigation of nanofluids on sintered heat pipe thermal performance. Applied Thermal Engineering 2009, 29(5-6):973-979.
    • (2009) Applied Thermal Engineering , vol.29 , Issue.5-6 , pp. 973-979
    • Kang, S.W.1    Wei, W.C.2    Tsai, S.H.3    Huang, C.C.4
  • 22
    • 33745261255 scopus 로고    scopus 로고
    • Experimental investigation of silver nano-fluid on heat pipe thermal performance
    • Kang S.W., Wei W.C., Tsai S.H., Yang S.Y. Experimental investigation of silver nano-fluid on heat pipe thermal performance. Applied Thermal Engineering 2006, 26(17-18):2377-2382.
    • (2006) Applied Thermal Engineering , vol.26 , Issue.17-18 , pp. 2377-2382
    • Kang, S.W.1    Wei, W.C.2    Tsai, S.H.3    Yang, S.Y.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.