|
Volumn 52, Issue 1-2, 2009, Pages 301-308
|
Loop heat pipe for cooling of high-power electronic components
|
Author keywords
Evaporation; Heat transfer; Loop heat pipe; Wick structure
|
Indexed keywords
ACTIVE FILTERS;
CONDENSERS (LIQUEFIERS);
COOLING;
COOLING SYSTEMS;
HEAT EXCHANGERS;
HEAT PIPES;
HEAT TRANSFER;
HEATING EQUIPMENT;
PIPE;
SATELLITE OBSERVATORIES;
THERMAL LOAD;
THERMOANALYSIS;
TITANIUM;
APPLICATIONS.;
CONDENSER TEMPERATURES;
DRASTIC EFFECTS;
EXPERIMENTAL PROGRAMS;
GRAVITY FIELDS;
HEAT LOADS;
HIGH POWERS;
LOOP HEAT PIPE;
LOOP HEAT PIPES;
NEW DEVELOPMENTS;
NODAL MODELS;
OUTER DIAMETERS;
PERFORMANCE TESTS;
PERIODIC MODES;
SPATIAL ORIENTATIONS;
TEMPERATURE LEVELS;
WICK STRUCTURE;
EVAPORATORS;
|
EID: 57049095911
PISSN: 00179310
EISSN: None
Source Type: Journal
DOI: 10.1016/j.ijheatmasstransfer.2008.06.016 Document Type: Article |
Times cited : (148)
|
References (6)
|