Three-dimensional photoacoustic imaging by a CMOS micromachined capacitive ultrasonic sensor

IEEE Electron Device Letters

Volumn 32, Issue 8, 2011, Pages 1149-1151

  Li, Meng Lin ^a   Wang, Po Hsun ^a   Liao, Pei Liang ^a   Lu, Michael S C ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Capacitive sensors; CMOS technology; microelectromechanical systems (MEMS); photoacoustic imaging

Indexed keywords

CAPACITANCE VALUES; CAPACITIVE SENSOR; CMOS TECHNOLOGY; INNER DIAMETERS; LARGE APERTURE; MECHANICAL SCANNING; METAL ETCH; MICROELECTROMECHANICAL SYSTEMS (MEMS); MICROMACHINED; PHOTO-ACOUSTIC IMAGING; PHOTOACOUSTIC IMAGE; POST-CMOS; SENSING ELEMENTS; SENSING MEMBRANES; SPATIAL RESOLUTION; SYNTHETIC APERTURE FOCUSING TECHNIQUES;

CARBON FIBERS; CMOS INTEGRATED CIRCUITS; IMAGE RECONSTRUCTION; MEMS; MICROELECTROMECHANICAL DEVICES; PHOTOACOUSTIC EFFECT; SENSORS; SILICA; SYNTHETIC APERTURES; ULTRASONIC APPLICATIONS; ULTRASONIC SENSORS; ULTRASONICS;

THREE DIMENSIONAL;

EID: 79960906971     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2011.2157655     Document Type: Article

References (7)

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