메뉴 건너뛰기




Volumn 271, Issue 9-10, 2011, Pages 1515-1523

Fretting behaviour of various intermetallic compounds in electrical contacts: Influence on reliability

Author keywords

Electrical contact resistance; Fretting; Intermetallic; Tin; Wear

Indexed keywords

AFTER-HEAT TREATMENT; COMPOSITION PROFILE; DIFFERENT STRUCTURE; ELECTRICAL CONTACT RESISTANCE; ELECTRICAL CONTACTS; ELECTRONIC DEVICE; ELECTRONIC INDUSTRIES; FAILURE MECHANISM; FRETTING; FRETTING BEHAVIOUR; NEEDLE SHAPE; NUMBER OF CYCLES; PHYSICOCHEMICAL TECHNIQUES; TIN COATING; TIN LAYERS; TRIBOLOGICAL BEHAVIOUR; UNDERLAYERS;

EID: 79960677815     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2010.12.041     Document Type: Article
Times cited : (12)

References (17)
  • 2
    • 0021645415 scopus 로고
    • Fretting wear
    • Waterhouse R.B. Fretting wear. Wear 1984, 100:107.
    • (1984) Wear , vol.100 , pp. 107
    • Waterhouse, R.B.1
  • 3
    • 0021394368 scopus 로고
    • Survey of contact fretting in electrical connectors
    • Antler M. Survey of contact fretting in electrical connectors. IEEE Trans. CHMT 1985, 8(1):87.
    • (1985) IEEE Trans. CHMT , vol.8 , Issue.1 , pp. 87
    • Antler, M.1
  • 4
    • 33846098872 scopus 로고    scopus 로고
    • Effect of temperature on the fretting corrosion of tin platted copper alloy contacts
    • Park Y.W., Sankara Narayanan T.S.N., Lee K.Y. Effect of temperature on the fretting corrosion of tin platted copper alloy contacts. Wear 2007, 262:320.
    • (2007) Wear , vol.262 , pp. 320
    • Park, Y.W.1    Sankara Narayanan, T.S.N.2    Lee, K.Y.3
  • 5
    • 0016928943 scopus 로고
    • Intermetallic growth and contact resistance of tin contacts after ageing
    • Lindborg U., Asthner B., Lind L., Reyan L.R. Intermetallic growth and contact resistance of tin contacts after ageing. IEEE Trans CMPT 1976, 12(1):33.
    • (1976) IEEE Trans CMPT , vol.12 , Issue.1 , pp. 33
    • Lindborg, U.1    Asthner, B.2    Lind, L.3    Reyan, L.R.4
  • 6
    • 0033692030 scopus 로고    scopus 로고
    • The impact of sliding motion and current load on the deterioration of tin-coated contact terminals
    • Hamman T. The impact of sliding motion and current load on the deterioration of tin-coated contact terminals. IEEE Trans CMPT 2000, 23(2):278.
    • (2000) IEEE Trans CMPT , vol.23 , Issue.2 , pp. 278
    • Hamman, T.1
  • 7
    • 33845309607 scopus 로고    scopus 로고
    • Solid state diffusion in Cu-Sn and Ni-Sn diffusion couples with flip-chip scale dimensions
    • Labie R. Solid state diffusion in Cu-Sn and Ni-Sn diffusion couples with flip-chip scale dimensions. J. Intermetallics 2007, 15:396.
    • (2007) J. Intermetallics , vol.15 , pp. 396
    • Labie, R.1
  • 8
    • 17044420501 scopus 로고    scopus 로고
    • Interdiffusion coefficients of various cobalt base alloy coatings for Cu/Au systems
    • Siu C.L., Man H.C., Yeung C.H. Interdiffusion coefficients of various cobalt base alloy coatings for Cu/Au systems. Appl. Surf. Sci. 2005, 245:79.
    • (2005) Appl. Surf. Sci. , vol.245 , pp. 79
    • Siu, C.L.1    Man, H.C.2    Yeung, C.H.3
  • 9
    • 33846411062 scopus 로고    scopus 로고
    • Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives
    • Gao F., Takemoto T., Nishikawa H. Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives. J. Electron. Mater. 2006, 35(12):2081.
    • (2006) J. Electron. Mater. , vol.35 , Issue.12 , pp. 2081
    • Gao, F.1    Takemoto, T.2    Nishikawa, H.3
  • 10
    • 0020807070 scopus 로고
    • Intermetallic compound growth and solderability
    • Davis P.E. Intermetallic compound growth and solderability. J. Plat. Surf. Finish. 1983, 70:49.
    • (1983) J. Plat. Surf. Finish. , vol.70 , pp. 49
    • Davis, P.E.1
  • 13
    • 34047157123 scopus 로고    scopus 로고
    • Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing
    • Chao B., Chae S.H., Zhang X., Lu K.H., Im J., Ho P.S. Investigation of diffusion and electromigration parameters for Cu-Sn intermetallic compounds in Pb-free solders using simulated annealing. J. Acta Mater. 2007, 55:2805.
    • (2007) J. Acta Mater. , vol.55 , pp. 2805
    • Chao, B.1    Chae, S.H.2    Zhang, X.3    Lu, K.H.4    Im, J.5    Ho, P.S.6
  • 17
    • 0035444056 scopus 로고    scopus 로고
    • The fretting sliding transition as a criterion for electrical contact performance
    • Hannel S., Fouvry S., Kapsa Ph., Vincent L. The fretting sliding transition as a criterion for electrical contact performance. Wear 2001, 249:761.
    • (2001) Wear , vol.249 , pp. 761
    • Hannel, S.1    Fouvry, S.2    Kapsa, P.3    Vincent, L.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.