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Volumn 37, Issue 7, 2011, Pages 2255-2261

Mechanical behavior and failure mechanisms of boron carbide based three-layered laminates with weak interfaces

Author keywords

Ceramics; Fracture toughness; Laminate; Residual stress

Indexed keywords

CERAMICS; COEFFICIENTS OF THERMAL EXPANSIONS; COMPRESSIVE RESIDUAL STRESS; FAILURE MECHANISM; FRACTURE TOUGHNESS VALUES; MECHANICAL BEHAVIOR; OUTER LAYER; THERMAL RESIDUAL STRESS; THRESHOLD STRESS; WEAK INTERFACE; YOUNG'S MODULUS;

EID: 79960327966     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2011.03.065     Document Type: Article
Times cited : (13)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.