Apparent fracture toughness of Si3N4-based laminates with residual compressive or tensile stresses in surface layers

Acta Materialia

Volumn 53, Issue 2, 2005, Pages 289-296

  Lugovy, M ^a   Slyunyayev, V ^a   Orlovskaya, N ^b   Blugan, G ^c   Kuebler, J ^c   Lewis, M ^d  

^a FRANTSEVICH INSTITUTE FOR PROBLEMS OF MATERIALS SCIENCE   (Ukraine)

^b DREXEL UNIVERSITY   (United States)

^c SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^d UNIVERSITY OF WARWICK   (United Kingdom)

Author keywords

A. Layered structures; B. Fracture toughness; C. Crack; Modeling; Residual stress

Indexed keywords

BALL MILLING; COMPRESSIVE STRESS; CRACK PROPAGATION; ELASTIC MODULI; FRACTURE TOUGHNESS; GRAIN SIZE AND SHAPE; HOT PRESSING; MATHEMATICAL MODELS; RESIDUAL STRESSES; TENSILE STRENGTH; THERMAL EXPANSION;

COEFFICIENTS OF THERMAL EXPANSION (CTE); FRACTURE RESISTANCE; LAYERED STRUCTURES; SINGLE EDGE V-NOTCH BEAM (SEVNB);

SILICON COMPOUNDS;

EID: 10044244643     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2004.09.022     Document Type: Article

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