Low-pressure thermal bonding

Microelectronic Engineering

Volumn 88, Issue 8, 2011, Pages 2427-2430

  Wang, Xudi ^a   Jin, Jian ^a   Li, Xin ^a   Li, Xiaojun ^b   Ou, Yin ^c   Tang, Qisheng ^a   Fu, Shaojun ^b   Gao, Fuhua ^d  

^a HEFEI UNIVERSITY OF TECHNOLOGY   (China)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

^c DongGuan Janus Co Ltd   (China)

^d SICHUAN UNIVERSITY   (China)

Author keywords

Capillarity; Low pressure; Micro nano channel; Thermal bonding

Indexed keywords

BIOLOGICAL APPLICATIONS; BONDING LAYERS; BONDING MECHANISM; BONDING TEMPERATURES; CAPILLARY FORCE; CHAIN ENTANGLEMENTS; CONFORMAL CONTACTS; FABRICATION TECHNIQUE; FLEXIBLE FILMS; FLUIDIC CONTROL; LOW PRESSURES; LOW-PRESSURE; MASS PRODUCTION; MICRO/NANO-CHANNEL; PET FILMS; STRUCTURE LAYERS; THERMAL BONDING;

FILLED POLYMERS; FLUIDIC DEVICES;

POLYMERS;

EID: 79960063941     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2011.01.022     Document Type: Conference Paper

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