Optical systems for data centers

2011 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference, OFC/NFOEC 2011

Volumn , Issue , 2011, Pages

  Ho, Ron ^a   Schwetman, Herb ^a   Mccracken, Michael O ^a   Koka, Pranay ^a   Lexau, Jon ^a   Cunningham, John E ^a   Zheng, Xuezhe ^a   Krishnamoorthy, Ashok V ^a  

^a ORACLE CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY EFFICIENCY; GREEN COMPUTING; LARGE SCALE SYSTEMS; OPTICAL FIBERS;

COMPACT SYSTEM; DATA CENTERS; HIGH PERFORMANCE COMPUTERS;

OPTICAL FIBER COMMUNICATION;

EID: 79959997893     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1364/ofc.2011.otuh1     Document Type: Conference Paper

References (18)

1. G. Astfalk, "Why optical data communications and why now?" Applied Physics A, vol. 95, no. 4, pp. 933-940, June 2009.
2. http://www.eia.doe.gov.
3. A. Krishnamoorthy et al., "Computer systems based on silicon photonic interconnects," Proceedings of the IEEE, vol. 97, no. 7, pp. 1337-1361, July 2009.
4. R. Ho et al., "Optical interconnect for high-end computer systems," IEEE Design and Test of Computers, in press, 2010.
5. http://www.itrs.net.
6. G. Moore, "Cramming more components onto integrated circuits," Electronics, vol. 38, no. 8, pp. 114-117, Apr. 1965.
7. -, "No exponential is forever," in IEEE International Solid State Circuits Conference, Dig. of Tech. Papers, Feb. 2003, pp. 20-23.
8. J. Cunningham et al., "Optical proximity communication in packaged Si photonics," in IEEE International Conference on Group IV Photonics, Sept. 2008, pp. 383-385.
9. -, "Aligning chips face-to-face for dense capacitive communications," in Coupled Data Communication Techniques for HighPerformance and Low-Power Computing, R. Ho and R. Drost, Eds. New York, NY: Springer, 2010, ch. 1, pp. 157-178.
10. X. Zheng et al., "An ultra-low energy all CMOS modulator integrated with driver," Optics Express, no. 3, pp. 3059-3070, 2010.
11. G. Li et al., "Ultralow-power high-performance Si photonic transmitter," in OSA Optical Fiber Communications Conference, Mar. 2010.
12. X. Zheng et al., "A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems," Optics Express, no. 1, pp. 204-211, 2010.
13. -, "Ultra-low power silicon photonic transceivers for inter/intra-chip interconnects," in Proceedings, SPIE Optics + Photonics, Aug. 2010.
14. I. Shubin et al., "Novel packaging with rematable spring interconnect chips for MCMs," in Proceedings, 59th Electronic Components and Technology Conference, May 2009.
15. J. Mitchell et al., "Integrating novel packaging technologies for large-scale computer systems," in ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS (Interpack), June 2009.
16. I. Shubin et al., "A package demonstration with solder free compliant flexible interconnects," in Proceedings, 60th Electronic Components and Technology Conference, June 2010, pp. 1429-1435.
17. W. Dally and B. Towles, Principles and Practices of Interconnection Networks. San Francisco, CA: Morgan Kaufmann, 2003.
18. P. Koka et al., "Silicon-photonic network architectures for scalable, power-efficient multi-chip systems," in Proceedings of the 37th International Symposium on Computer Architecture, June 2010.