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Volumn 34, Issue 1, 2011, Pages 699-704
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Modeling copper chemical mechanical polishing processes using linear system method
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER CHEMICAL-MECHANICAL POLISHING;
DOWN FORCE;
EXPERIMENTAL DATA;
PATTERN STRUCTURE;
SIMULATION RESULT;
SOLID-SOLID CONTACTS;
EROSION;
LINEAR SYSTEMS;
SEMICONDUCTOR DEVICE MANUFACTURE;
TEXTILE PRINTING;
CHEMICAL MECHANICAL POLISHING;
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EID: 79959677899
PISSN: 19385862
EISSN: 19386737
Source Type: Conference Proceeding
DOI: 10.1149/1.3567660 Document Type: Conference Paper |
Times cited : (3)
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References (8)
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