Interfacial reaction during friction stir welding of Al and Cu

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 42, Issue 8, 2011, Pages 2290-2295

  Genevois, C ^a   Girard, M ^b   Huneau, B ^b   Sauvage, X ^a   Racineux, G ^b  

^a UNIVERSITÉ DE ROUEN   (France)

^b ECOLE CENTRALE DE NANTES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM PLATES; BONDING LAYERS; DEFECT-FREE; FRICTIONAL HEATING; INTERDIFFUSION REACTIONS; INTERMETALLIC LAYER; MECHANICAL MIXING; NANOSCALED; NUCLEATION AND GROWTH; PURE COPPER; THERMALLY ACTIVATED; TWO-MATERIALS;

ALUMINUM; FRICTION; GAS WELDING; INTERFACES (MATERIALS); TRANSMISSION ELECTRON MICROSCOPY;

FRICTION STIR WELDING;

EID: 79959557194     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-011-0660-9     Document Type: Article

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